Thermosetting resin composition and cured product of the same
    1.
    发明授权
    Thermosetting resin composition and cured product of the same 失效
    热固性树脂组合物和固化产物相同

    公开(公告)号:US08470913B2

    公开(公告)日:2013-06-25

    申请号:US13375118

    申请日:2010-05-24

    Applicant: Eijyu Ichinose

    Inventor: Eijyu Ichinose

    Abstract: An object of the present invention is to provide a thermosetting resin composition having high heat resistance, high flame retardancy, good mechanical properties, and high dimensional stability. To achieve the object, there are provided a thermosetting resin composition containing a polyimide resin and a boron compound represented by general formula below and a cured product of the thermosetting resin composition. (R1's each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms. R2's each independently represent hydrogen, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms. Y represents a nitrogen-containing heterocyclic compound. R3's each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms. Z represents a nitrogen-containing heterocyclic compound.)

    Abstract translation: 本发明的目的是提供一种具有高耐热性,高阻燃性,良好机械性能和高尺寸稳定性的热固性树脂组合物。 为了达到上述目的,提供一种热固性树脂组合物,其含有下述通式所示的聚酰亚胺树脂和硼化合物以及热硬化性树脂组合物的固化物。 (R 1各自独立地表示氢原子,碳原子数1〜4的烷基或碳原子数1〜4的烷氧基,R 2各自独立地表示氢,碳原子数1〜4的烷基或烷氧基 具有1〜4个碳原子,Y表示含氮杂环化合物,R 3各自独立地表示氢原子,碳原子数1〜4的烷基或碳原子数1〜4的烷氧基,Z表示氮原子, 含杂环化合物)

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