公开(公告)号：US20240286848A1

公开(公告)日：2024-08-29

申请号：US18444669

申请日：2024-02-17

Applicant: RE:DISH CO.

Inventor： Thomas McCarthy ,  Caroline Vanderlip

IPC: B65G43/08 ,  B08B1/12 ,  B08B1/32 ,  B08B1/52 ,  B08B3/02 ,  B65G45/18 ,  B65G45/22 ,  B65G47/06 ,  B65G47/82 ,  G06K7/10 ,  G06K7/14

CPC classification number: B65G43/08 ,  B08B1/12 ,  B08B1/32 ,  B08B1/52 ,  B08B3/022 ,  B65G45/18 ,  B65G45/22 ,  B65G47/82 ,  G06K7/10366 ,  G06K7/1413 ,  G06K7/1417 ,  B65G47/06 ,  B65G2203/0216

Abstract: New systems, methods and devices for the management of reusable food containers, such as dishes and/or trays, are provided. Systems and devices for managing a large inventory of dishes or trays to be re-used, are provided. A re-usable tray management and processor device is provided. The re-usable tray management and processor device includes a control system, a first, tray-receiving end, a tray conveyor, at least one scanning device(s), a denester/dispenser, a separator and an offloading end, configured to offload soiled reusable food containers to a washing, drying and packing section. Rotary release actuator(s) are included within the denester/dispenser. And a new form of rotary actuator and brush and excavator tool is provided, coupled with each of the rotary release actuators. In some embodiments, the control system plans actions downstream of a pre-cleaning station, based on data received from the scanning device(s).

公开(公告)号：US20250040693A1

公开(公告)日：2025-02-06

申请号：US18438750

申请日：2024-02-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： DONGHOON KWON ,  Jaemin Jung

IPC: A46B17/06 ,  A46B13/00 ,  B08B1/52 ,  B08B3/12 ,  H01L21/67

Abstract: A wafer cleaning apparatus includes a wafer roller rotating a wafer around a first direction parallel to a normal direction of a first surface of the wafer, a first brush facing the first surface of the wafer, a second brush facing a second surface of the wafer opposite to the first surface, a first cleaning tank disposed apart from the first brush and movable to accommodate at least a portion of the first brush, and a second cleaning tank disposed apart from the second brush and movable to accommodate at least a portion of the second brush. The first and second cleaning tanks include a first solution injection member connected to a first solution supply pipe and a second solution injection member connected to a second solution supply pipe, respectively. Each of the first and second solution injection members includes a bubble generating filter having a plurality of through-holes.

公开(公告)号：US20240316600A1

公开(公告)日：2024-09-26

申请号：US18030753

申请日：2021-08-25

Applicant: EBARA CORPORATION

Inventor： Kenji KODERA ,  Masayuki NAKANISHI

IPC: B08B1/20 ,  B08B1/30 ,  B08B1/52 ,  B08B1/54 ,  H01L21/02 ,  H01L21/67

CPC classification number: B08B1/20 ,  B08B1/30 ,  B08B1/52 ,  B08B1/54 ,  H01L21/02057 ,  H01L21/67046 ,  H01L21/67051

Abstract: The present invention relates to a substrate cleaning apparatus and a substrate cleaning method for cleaning a substrate, such as a semiconductor wafer, and more particularly to a substrate cleaning apparatus and a substrate cleaning method for cleaning a periphery of a substrate. A substrate cleaning apparatus (1) includes: a substrate holder (10) configured to hold and rotate a substrate (W); a pressing structure (22) having an internal space (R) and configured to press a cleaning tape (19) against a periphery of the substrate (W); a pressing-structure moving mechanism (30) configured to regulate a position of the pressing structure (22) in a radial direction of the substrate (W); and a pressure regulator (44) configured to regulate pressure in the internal space (R). The pressing structure (22) includes: a hollow support member (24) having an opening (25); and an elastic element (27) configured to support the cleaning tape (19). The elastic element (27) is arranged to close the opening (25).