Display panel, method of inspecting lead bonding of display panel, and lead bonding method of display panel
    1.
    发明授权
    Display panel, method of inspecting lead bonding of display panel, and lead bonding method of display panel 有权
    显示面板,显示面板引线接合检查方法,显示面板引线接合方法

    公开(公告)号:US08009258B2

    公开(公告)日:2011-08-30

    申请号:US11773969

    申请日:2007-07-06

    Inventor: Yung-Chien Chen

    Abstract: A display panel including a substrate and a plurality of films for carrying chips is provided. The substrate has a display region and a non-display region located at one side of the display region. The non-display region has a plurality of pad regions, and each pad region has a plurality of first leads and at least one first displacement measuring mark disposed therein. The first displacement measuring mark is located at at least one side of all the first leads. The films for carrying chips are correspondingly sticking on the substrate. Each film for carrying chips has a plurality of second leads and at least one second displacement measuring mark. The second displacement measuring mark is located at least one side of all the second leads and is corresponding to the first displacement measuring mark. The second leads are correspondingly connected with the first leads.

    Abstract translation: 提供一种显示面板,包括基板和多个用于承载芯片的薄膜。 基板具有位于显示区域一侧的显示区域和非显示区域。 非显示区域具有多个焊盘区域,并且每个焊盘区域具有多个第一引线和设置在其中的至少一个第一位移测量标记。 第一位移测量标记位于所有第一引线的至少一侧。 用于承载芯片的膜相应地粘附在基板上。 用于承载芯片的每个薄膜具有多个第二引线和至少一个第二移位测量标记。 第二位移测量标记位于所有第二引线的至少一侧,并且对应于第一位移测量标记。 第二引线相应地与第一引线连接。

    DISPLAY PANEL, METHOD OF INSPECTING LEAD BONDING OF DISPLAY PANEL, AND LEAD BONDING METHOD OF DISPLAY PANEL
    3.
    发明申请
    DISPLAY PANEL, METHOD OF INSPECTING LEAD BONDING OF DISPLAY PANEL, AND LEAD BONDING METHOD OF DISPLAY PANEL 有权
    显示面板,显示面板引线接合检查方法,显示面板引线接合方法

    公开(公告)号:US20080223501A1

    公开(公告)日:2008-09-18

    申请号:US11773969

    申请日:2007-07-06

    Inventor: Yung-Chien Chen

    Abstract: A display panel including a substrate and a plurality of films for carrying chips is provided. The substrate has a display region and a non-display region located at one side of the display region. The non-display region has a plurality of pad regions, and each pad region has a plurality of first leads and at least one first displacement measuring mark disposed therein. The first displacement measuring mark is located at at least one side of all the first leads. The films for carrying chips are correspondingly sticking on the substrate. Each film for carrying chips has a plurality of second leads and at least one second displacement measuring mark. The second displacement measuring mark is located at least one side of all the second leads and is corresponding to the first displacement measuring mark. The second leads are correspondingly connected with the first leads.

    Abstract translation: 提供一种显示面板,包括基板和多个用于承载芯片的薄膜。 基板具有位于显示区域一侧的显示区域和非显示区域。 非显示区域具有多个焊盘区域,并且每个焊盘区域具有多个第一引线和设置在其中的至少一个第一位移测量标记。 第一位移测量标记位于所有第一引线的至少一侧。 用于承载芯片的膜相应地粘附在基板上。 用于承载芯片的每个薄膜具有多个第二引线和至少一个第二移位测量标记。 第二位移测量标记位于所有第二引线的至少一侧,并且对应于第一位移测量标记。 第二引线相应地与第一引线连接。

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