公开(公告)号：US20150003020A1

公开(公告)日：2015-01-01

申请号：US14490425

申请日：2014-09-18

Applicant: c/o SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Suk Chang HONG ,  Kwang Seop YOUM ,  Bong Kyu CHOI

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0203 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/12105 ,  H01L2224/24227 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H05K1/0207 ,  H05K1/111 ,  H05K1/115 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/1028 ,  H05K2201/10439 ,  H05K2201/10674 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2224/05599

Abstract: An electronic component-embedded printed circuit board includes: a core substrate having a cavity; an electronic component in the cavity; an inner circuit layer formed on the core substrate; a cooling member provided on the first surface of the core substrate at a position over the cavity; and an outer insulating layer on the core substrate. In one embodiment, the cooling member is covering over a portion of the outer surface of the inner circuit layer, and is adhered to the electronic component and to the outer surface of the inner circuit layer through a conductive material.

Abstract translation: 电子元件嵌入式印刷电路板包括：具有空腔的芯基板; 空腔中的电子部件; 形成在所述芯基板上的内电路层; 设置在所述芯基板的所述第一表面上的空腔上方的位置的冷却部件; 和芯基板上的外绝缘层。 在一个实施例中，冷却构件覆盖在内部电路层的外表面的一部分上，并且通过导电材料粘附到电子部件和内部电路层的外表面。