公开(公告)号：US20230369550A1

公开(公告)日：2023-11-16

申请号：US18028169

申请日：2021-09-15

Applicant: ams-OSRAM International GmbH

Inventor： Norwin VON MALM ,  Laura KREINER ,  Matthias GOLDBACH

IPC: H01L33/58 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L33/58 ,  H01L25/0753 ,  H01L33/62 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: The invention relates to a method for producing a plurality of optoelectronic semiconductor components, comprising the steps: a) providing a carrier composite having a plurality of component regions; b) forming a filter layer on the carrier composite; c) forming a radiation conversion layer on the filter layer; d) arranging a plurality of semiconductor bodies on the radiation conversion layer, wherein the semiconductor bodies each have a semiconductor layer sequence having an active region provided for radiation generation and are free of a substrate stabilizing the semiconductor body; e) forming a contact layer for producing an electrical connection between the semiconductor bodies; f) forming an insulation layer on the contact layer; g) forming electrical contact surfaces, each of which are electrically conductively connected to the contact layer; and h) separating the carrier composite into the optoelectronic semiconductor components.--

公开(公告)号：US20230021522A1

公开(公告)日：2023-01-26

申请号：US17788238

申请日：2021-05-14

Applicant: ams-OSRAM International GmbH

Inventor： Matthias GOLDBACH ,  Georg BOGNER

IPC: H01L25/075 ,  H01L33/48 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62

Abstract: The invention relates to a component (100) having an electrically insulating and radiation-transparent substrate (9) and at least one semiconductor chip (10) arranged on the substrate (9). The semiconductor chip (10) is designed to generate electromagnetic radiation and has a front side (11) and a rear side (12) facing away from the front side (11), wherein the front side (11) of the semiconductor chip (10) faces the substrate (9) and is designed as a radiation exit face of the semiconductor chip (10), and wherein the rear side (12) of the semiconductor chip (10) faces away from the substrate (9), wherein the semiconductor chip (10) can be electrically contacted externally via the rear side (12). The invention further relates to a method for producing such a component.

公开(公告)号：US20230102780A1

公开(公告)日：2023-03-30

申请号：US17798855

申请日：2021-02-09

Applicant: ams-OSRAM International GmbH

Inventor： Berthold HAHN ,  Matthias GOLDBACH ,  Georg BOGNER

IPC: H01L33/58 ,  H01L25/075 ,  H01L33/50 ,  H01L33/60 ,  H01L33/64

Abstract: An optoelectronic device includes a glass carrier, at least one light-scattering layer applied to the glass carrier, and at least one surface-emitting component in a chip size package with an emission surface and a surface facing away from the emission surface having a first and a second contact pad. The emission surface is arranged on the at least one light-scattering layer by way of an adhesive. At least one contact line contacts the second contact pad of the at least one surface-emitting component and extends along a side surface of the at least one surface-emitting component adjacent to the second contact pad in a direction of the glass carrier. A light-shaping structure is arranged on a surface of the glass carrier facing away from the surface-emitting component.