公开(公告)号：US20090091896A1

公开(公告)日：2009-04-09

申请号：US11905802

申请日：2007-10-04

Applicant: Yu-Lin HSIEH

Inventor： Yu-Lin HSIEH

IPC: H05K5/00 ,  H01L33/00 ,  H05K3/30 ,  F21V21/00

CPC classification number: H05K1/182 ,  H05K5/0269 ,  H05K2201/10106 ,  Y10T29/4913

Abstract: The present invention discloses a structure of a single-sided PCB within an ExpressCard with SMD LEDs arrangement formed thereon. The SMD LEDs are act as status indicators for the electronic devices with small, thin and compact size. The structure is expected to form SMD LED illuminating light to the top surface of the PCB with SMD LEDs connecting to the bonding pads on the bottom surface of the PCB. The method comprises forming through-holes on the PCB, placing SMD LEDs over the through-holes with their illuminating heads facing toward the top surface of the PCB, soldering the SMD LEDs with the bonding pads on the bottom surface of the PCB.

Abstract translation: 本发明公开了在其中形成有SMD LED布置的ExpressCard中的单面PCB的结构。 SMD LED用作小型，薄型和紧凑尺寸的电子设备的状态指示器。 该结构预计将形成SMD LED照明光到PCB的顶表面，SMD LED连接到PCB底部的接合焊盘。 该方法包括在PCB上形成通孔，将SMD LED放置在通孔上方，其照明头面向PCB的顶面，用PCB的底面上的焊盘焊接SMD LED。