公开(公告)号：US20100078669A1

公开(公告)日：2010-04-01

申请号：US12569208

申请日：2009-09-29

申请人： Yu-Jeong CHO ,  Kyung-Nam Kim ,  Kwang-Yong Oh

发明人： Yu-Jeong CHO ,  Kyung-Nam Kim ,  Kwang-Yong Oh

IPC分类号： H01L33/00 ,  H01L23/495

CPC分类号： H01L33/60 ,  H01L33/46 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： An LED according to the present invention includes a light-emitting chip emitting light, a chip-mounting portion on which the light-emitting chip is mounted, a light-reflecting layer formed on at least a portion of the chip-mounting portion and a gold plating layer formed on at least a portion of the light-reflecting layer, the gold plating layer having a thickness such that the gold plating layer has a different color from a color of gold. The chip-mounting portion may have various shapes and materials. For example, the chip-mounting portion may be a lead terminal, a slug, a printed circuit board, a ceramic substrate, a CNT substrate, etc.

摘要翻译： 根据本发明的LED包括发光芯片发光器件，安装有发光芯片的芯片安装部分，形成在芯片安装部分的至少一部分上的光反射层和 镀金层形成在光反射层的至少一部分上，镀金层具有使得镀金层具有与金色不同的颜色的厚度。 芯片安装部分可以具有各种形状和材料。 例如，芯片安装部分可以是引线端子，芯片，印刷电路板，陶瓷衬底，CNT衬底等。