公开(公告)号：US09454498B1

公开(公告)日：2016-09-27

申请号：US14194498

申请日：2014-02-28

Applicant: Xilinx, Inc.

Inventor： William E. Allaire ,  Bradley L. Taylor ,  Ting Lu ,  Sandeep Dutta ,  Patrick J. Crotty ,  Hassan K. Bazargan ,  Hy V. Nguyen ,  Shashank Bhonge

IPC: G06F13/10 ,  G06F15/78 ,  G06F1/26

CPC classification number: G06F13/10 ,  G06F1/26 ,  G06F1/3287 ,  G06F15/7867 ,  G06F15/7871 ,  Y02D10/171

Abstract: An integrated circuit can include a processor system configured to execute program code. The processor system can be hard-wired and include a processor hardware resource. The IC also can include a programmable circuitry configurable to implement different physical circuits. The programmable circuitry can be coupled to the processor system. The programmable circuitry can be configurable to share usage of the processor hardware resource of the processor system. The processor system further can control aspects of the programmable circuitry such as power on and/or off and also configuration of the programmable circuitry to implement one or more different physical circuits therein.

Abstract translation: 集成电路可以包括被配置为执行程序代码的处理器系统。 处理器系统可以是硬连线的并且包括处理器硬件资源。 IC还可以包括可配置为实现不同物理电路的可编程电路。 可编程电路可以耦合到处理器系统。 可编程电路可以被配置为共享处理器系统的处理器硬件资源的使用。 处理器系统还可以控制诸如上电和/或关断的可编程电路的方面，并且还可以配置可编程电路以在其中实现一个或多个不同的物理电路。

公开(公告)号：US11302674B2

公开(公告)日：2022-04-12

申请号：US16880811

申请日：2020-05-21

Applicant: XILINX, INC.

Inventor： Jaspreet Singh Gandhi ,  Suresh Ramalingam ,  William E. Allaire ,  Hong Shi ,  Kerry M. Pierce

IPC: H01L25/065 ,  H01L23/00 ,  H01L25/00

Abstract: A chip package assembly and method for fabricating the same are provided that provide a modular chip stack that can be matched with one or more chiplets. The use of chiplets enables the same modular stack to be utilized in a large number of different chip package assembly designs, resulting much faster development times at a fraction of the overall solution cost.