公开(公告)号：US11961823B1

公开(公告)日：2024-04-16

申请号：US17354927

申请日：2021-06-22

Applicant: XILINX, INC.

Inventor： Praful Jain ,  Martin Voogel ,  Brian Gaide

IPC: H01L25/065 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L24/16 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2924/15311

Abstract: Examples described herein generally relate to forming and/or configuring a die stack in a multi-chip device. An example is a method of forming a multi-chip device. Dies are formed. At least two or more of the dies are interchangeable. Characteristics of the at least two or more of the dies that are interchangeable are determined. A die stack comprising the at least two or more of the dies that are interchangeable is formed. Respective placements within the die stack of the at least two or more of the dies that are interchangeable are based on the characteristics.

公开(公告)号：US11043480B1

公开(公告)日：2021-06-22

申请号：US16437498

申请日：2019-06-11

Applicant: XILINX, INC.

Inventor： Praful Jain ,  Martin Voogel ,  Brian Gaide

IPC: H01L25/00 ,  H01L21/66 ,  H01L25/065

Abstract: Examples described herein generally relate to forming and/or configuring a die stack in a multi-chip device. An example is a method of forming a multi-chip device. Dies are formed. At least two or more of the dies are interchangeable. Characteristics of the at least two or more of the dies that are interchangeable are determined. A die stack comprising the at least two or more of the dies that are interchangeable is formed. Respective placements within the die stack of the at least two or more of the dies that are interchangeable are based on the characteristics.

公开(公告)号：US11017822B1

公开(公告)日：2021-05-25

申请号：US16672089

申请日：2019-11-01

Applicant: XILINX, INC.

Inventor： Sree Rkc Saraswatula ,  Narendra Kumar Pulipati ,  Santosh Yachareni ,  Shidong Zhou ,  Sundeep Ram Gopal Agarwal ,  Brian Gaide

IPC: G11C5/14 ,  G11C29/50 ,  H01L25/065

Abstract: Examples described herein provide a method for disabling a defective portion of a fabric die of a stacked IC device. The method includes receiving a signal indicating that a portion of a fabric die of a stacked IC device including at least two fabric dies is defective. The method further includes, in response to the signal, pulling a source voltage rail of the defective portion to ground, thereby disabling the portion, and operating the remainder of the fabric die without interference from or contention with the disabled portion. In one example, the stacked IC device is an active on active (AoA) device, and the portion of the fabric die includes a configuration memory cell. In one example, the signal is received after power-up of the stacked IC device.