公开(公告)号：US20140016798A1

公开(公告)日：2014-01-16

申请号：US13937067

申请日：2013-07-08

Applicant: Wolfson Microelectronics plc

Inventor： Richard Ian Laming ,  Anthony Traynor

IPC: B81C1/00 ,  B81B3/00 ,  H04R3/00

CPC classification number: B81C1/00158 ,  B81B3/0027 ,  B81B2201/0257 ,  B81C1/00246 ,  B81C1/00904 ,  B81C2201/056 ,  G01L9/0073 ,  H04R3/005 ,  H04R19/005 ,  H04R19/04

Abstract: A method of fabricating a micro-electrical-mechanical system (MEMS) apparatus on a substrate comprises the steps of processing the substrate so as to fabricate an electronic circuit; depositing a first electrode that is operably coupled with the electronic circuit; depositing a membrane so that it is mechanically coupled to the first electrode; applying a sacrificial layer; depositing a structural layer and a second electrode that is operably coupled with the electronic circuit so that the sacrificial layer is disposed between the membrane and the structural layer so as to form a preliminary structure; singulating the substrate; and removing the sacrificial layer so as to form a MEMS structure, in which the step of singulating the substrate is carried out before the step of removing the sacrificial layer.

Abstract translation: 在基板上制造微电子机械系统（MEMS）装置的方法包括以下步骤：处理基板以制造电子电路; 沉积与电子电路可操作耦合的第一电极; 沉积膜，使得其机械耦合到第一电极; 施加牺牲层; 沉积与电子电路可操作地耦合的结构层和第二电极，使得牺牲层设置在膜和结构层之间，以便形成初步结构; 单片基片; 以及去除所述牺牲层以形成MEMS结构，其中在去除所述牺牲层的步骤之前执行所述衬底的单分离步骤。