公开(公告)号：US20130067642A1

公开(公告)日：2013-03-21

申请号：US13239179

申请日：2011-09-21

Applicant: William CHEN

Inventor： William CHEN

IPC: A41F19/00 ,  A41F9/00

CPC classification number: A41C1/10

Abstract: A maternity belt structure includes at least one protection strap for supporting/holding lower belly of a pregnant woman, a waist protection board and at least one sling. The waist protection board is attached to the back of the pregnant woman for supporting the back. The protection straps extend from two sides of the waist protection board and are wound over the waist of the pregnant woman to the lower belly to connect with each other for providing a first support force. For a humpback pregnant woman, the sling is conducted through the armpit and wound over the shoulder to connect with the protection straps and the waist protection board for providing a second support force. Therefore, the lower belly supporting/holding force of the protection strap is enhanced and the pregnant woman can more comfortably wear the maternity belt to relieve the waist and back soreness and minimize the risk of humpback.

Abstract translation: 产妇腰带结构包括至少一个用于支撑/保持孕妇的下腹部的保护带，腰部保护板和至少一个吊带。 腰部保护板贴在孕妇背后支撑背部。 保护带从腰部保护板的两侧延伸，并且在孕妇的腰部上缠绕到下腹部以彼此连接以提供第一支撑力。 对于一个驼背孕妇，吊带是通过腋下穿过并缠绕在肩上，与保护带和腰部保护板连接，以提供第二支撑力。 因此，保护​​带的下腹部支撑/保持力增强，孕妇可以更舒适地佩戴产妇腰带，减轻腰部酸痛并减少驼背的风险。

公开(公告)号：US20070166866A1

公开(公告)日：2007-07-19

申请号：US11686748

申请日：2007-03-15

Applicant: Bernd APPELT ,  William CHEN

Inventor： Bernd APPELT ,  William CHEN

IPC: H01L21/00

CPC classification number: H01L23/4334 ,  H01L24/48 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An optical semiconductor package includes a substrate, a chip, a plurality of bonding wires, a window, a supporter, and an encapsulant. The chip is disposed on the substrate and has an optical element. The bonding wires are used for electrically connecting the chip to the substrate. The window is supported on the supporter and positioned over the optical element of the chip. The encapsulant is overmolded on the substrate for fixing the window and encapsulating the chip and the bonding wires.

Abstract translation: 光学半导体封装包括基板，芯片，多个接合线，窗口，支撑件和密封剂。 芯片设置在基板上并具有光学元件。 接合线用于将芯片电连接到基板。 窗户支撑在支架上并定位在芯片的光学元件上。 密封剂在基板上被包覆成型，用于固定窗户并封装芯片和接合线。