公开(公告)号：US09361947B1

公开(公告)日：2016-06-07

申请号：US14735461

申请日：2015-06-10

申请人： Western Digital Technologies, Inc.

发明人： Baekho Heo ,  Cheng Jin ,  Sara Sahebjam-Atabaki ,  Jifang Tian ,  Zachary P. Hills

IPC分类号： G11B33/08 ,  G11B19/20

CPC分类号： G11B33/08 ,  G11B19/2018 ,  G11B33/025

摘要： A hard disk drive assembly having a hard disk drive positioned within an enclosure. A shock support is interposed between the hard disk drive and at least one wall of the enclosure so that external shocks on the enclosure are transmitted through the shock support. The shock support can be either a rigid support made of metal or a resilient support made of elastomeric material.

摘要翻译： 具有位于外壳内的硬盘驱动器的硬盘驱动器组件。 在硬盘驱动器和外壳的至少一个壁之间插入有冲击支撑，使得外壳上的外部冲击通过冲击支撑传递。 冲击支撑件可以是由金属制成的刚性支撑件或由弹性体材料制成的弹性支撑件。

公开(公告)号：US09947370B1

公开(公告)日：2018-04-17

申请号：US14735411

申请日：2015-06-10

申请人： Western Digital Technologies, Inc.

发明人： Cheng Jin ,  Jifang Tian ,  Michael J. Herrmann ,  Zachary P. Hills

IPC分类号： G11B33/08 ,  G06F1/18

CPC分类号： G11B33/08 ,  G06F1/187

摘要： A hard disk drive assembly having a hard disk drive positioned within an external housing. Isolators formed of a resilient material, such as an elastomeric material, are interposed between the hard disk drive and an external housing. The isolators also preferably having a plurality of openings that extend there through that lower the stiffness of the isolators during small deflections such as those caused by vibrations, but large deflections, such as those caused by shocks cause the openings or holes to close there by generating greater stiffness is response to external shocks.

公开(公告)号：US10120351B1

公开(公告)日：2018-11-06

申请号：US13957814

申请日：2013-08-02

申请人： Western Digital Technologies, Inc.

发明人： Zachary P. Hills ,  Jeffrey F. Boigenzahn ,  Robert G. Fairchild

IPC分类号： G05B15/02

摘要： An electronic device including electromechanical components, a cooling unit configured for heat removal for the electromechanical components, and a controller. The controller is configured to determine a system state of each of the electromechanical components based on temperature data for each of the electromechanical components and a temperature band corresponding to each of the electromechanical components, wherein the temperature data for each of the electromechanical components is sampled at a sample rate corresponding to each of the electromechanical components, determine a system state of the electronic device based on the system states of the electromechanical components, and control an operation of the cooling unit based on the system state of the electronic device.