-
公开(公告)号:US20220093559A1
公开(公告)日:2022-03-24
申请号:US17028484
申请日:2020-09-22
发明人: Kevin Du , Hope Chiu , Zengyu Zhou , Alex Zhang , Vincent Jiang , Shixing Zhu , Paul Qu , Yi Su , Rui Yuan
摘要: A packaged semiconductor includes a substrate and a first component disposed on the substrate. The package includes an underfill that is dispensed under and around the first component. The package also includes a second component disposed on the substrate adjacent to the first component that provides a border to the underfill.
-
公开(公告)号:US12021060B2
公开(公告)日:2024-06-25
申请号:US17028484
申请日:2020-09-22
发明人: Kevin Du , Hope Chiu , Zengyu Zhou , Alex Zhang , Vincent Jiang , Shixing Zhu , Paul Qu , Yi Su , Rui Yuan
CPC分类号: H01L25/0652 , H01L21/4853 , H01L21/563 , H01L23/3185 , H01L24/16 , H01L25/50 , H01L2224/16225 , H01L2225/06506 , H01L2225/06517 , H01L2225/06562 , H01L2225/06582 , H01L2924/14511 , H01L2924/18161 , H01L2924/19105
摘要: A packaged semiconductor includes a substrate and a first component disposed on the substrate. The package includes an underfill that is dispensed under and around the first component. The package also includes a second component disposed on the substrate adjacent to the first component that provides a border to the underfill.
-