WAFER TESTING SYSTEM INTEGRATED WITH RFID TECHNIQUES AND THESTING METHOD THEREOF
    1.
    发明申请
    WAFER TESTING SYSTEM INTEGRATED WITH RFID TECHNIQUES AND THESTING METHOD THEREOF 有权
    与RFID技术集成的测试系统及其方法

    公开(公告)号:US20090237098A1

    公开(公告)日:2009-09-24

    申请号:US12061781

    申请日:2008-04-03

    IPC分类号: G01R31/02

    CPC分类号: G01R31/01 G01R31/2893

    摘要: This invention provides a wafer testing system and testing method thereof. The wafer testing system comprises a wafer storage section, a prober, a tester, an RFID middleware unit, an EDA system and an MES system. The wafer storage section stores a multiplicity of carriers, each of which is provided with at least a RFID tag. The prober comprises a RFID reader to read a tag information. The tester sends a test signal to the prober for implementing the wafer test so as to generate a test result and calls an interface program to convert the test result into a file conformed with a specific data format. The RFID middleware unit receives the tag information and calls related applications to process the tag information so as to generate a wafer information. The EDA system receives the file of the specific data format converted from the interface program and calculates thereof to generate a wafer yield information after wafer test. The MES system integrates the wafer information from the RFID middleware unit with the yield information from the EDA system so as to allow monitoring the wafer manufacturing process and testing yield rate in a real-time manner.

    摘要翻译: 本发明提供了一种晶片测试系统及其测试方法。 晶片测试系统包括晶片存储部分,探测器,测试器,RFID中间件单元,EDA系统和MES系统。 晶片存储部存储多个载体,每个载体至少设有RFID标签。 该探测器包括读取标签信息的RFID读取器。 测试仪将测试信号发送到探测器,以实现晶片测试,以产生测试结果,并调用接口程序将测试结果转换为符合特定数据格式的文件。 RFID中间件单元接收标签信息并调用相关应用程序来处理标签信息以产生晶片信息。 EDA系统接收从接口程序转换的特定数据格式的文件,并计算它们以在晶片测试之后生成晶片产量信息。 MES系统将RFID中间件单元的晶圆信息与EDA系统的产量信息相集成,以便实时监控晶圆制造过程和测试成品率。

    Wafer testing system integrated with RFID techniques and thesting method thereof
    2.
    发明授权
    Wafer testing system integrated with RFID techniques and thesting method thereof 有权
    与RFID技术相结合的晶圆测试系统及其方法

    公开(公告)号:US07609053B2

    公开(公告)日:2009-10-27

    申请号:US12061781

    申请日:2008-04-03

    CPC分类号: G01R31/01 G01R31/2893

    摘要: This invention provides a wafer testing system and testing method thereof. The wafer testing system comprises a wafer storage section, a prober, a tester, an RFID middleware unit, an EDA system and an MES system. The wafer storage section stores a multiplicity of carriers, each of which is provided with at least a RFID tag. The prober comprises a RFID reader to read a tag information. The tester sends a test signal to the prober for implementing the wafer test so as to generate a test result and calls an interface program to convert the test result into a file conformed with a specific data format. The RFID middleware unit receives the tag information and calls related applications to process the tag information so as to generate a wafer information. The EDA system receives the file of the specific data format converted from the interface program and calculates thereof to generate a wafer yield information after wafer test. The MES system integrates the wafer information from the RFID middleware unit with the yield information from the EDA system so as to allow monitoring the wafer manufacturing process and testing yield rate in a real-time manner.

    摘要翻译: 本发明提供了一种晶片测试系统及其测试方法。 晶片测试系统包括晶片存储部分,探测器,测试器,RFID中间件单元,EDA系统和MES系统。 晶片存储部存储多个载体,每个载体至少设有RFID标签。 该探测器包括读取标签信息的RFID读取器。 测试仪将测试信号发送到探测器,以实现晶片测试,以产生测试结果,并调用接口程序将测试结果转换为符合特定数据格式的文件。 RFID中间件单元接收标签信息并调用相关应用程序来处理标签信息以产生晶片信息。 EDA系统接收从接口程序转换的特定数据格式的文件,并计算它们以在晶片测试之后生成晶片产量信息。 MES系统将RFID中间件单元的晶圆信息与EDA系统的产量信息相集成,以便实时监控晶圆制造过程和测试成品率。