公开(公告)号：US20020190366A1

公开(公告)日：2002-12-19

申请号：US10156002

申请日：2002-05-29

Applicant: Walsin Advanced Electronics LTD

Inventor： Chia-Yu Hung ,  Chun-Jen Su ,  Chien-Hung Lai

IPC: H01L023/06

CPC classification number: H01L23/3114 ,  H01L23/4951 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A micro BGA package comprises a die, a wiring board, a plurality of metal bonding wires, a plurality of solder balls, and a package body. The wiring board has a die-attaching surface, a surface-mounting surface with solder balls, and lateral surfaces between the die-attaching surface and the surface-mounting surface. The package body has a fastener covering and extending around the lateral surfaces of the wiring board for improving the bonding strength between wiring board and die and avoiding delamination. Preferably, the wiring board has a plurality of support bars for supporting the wiring board during molding.

Abstract translation: 微BGA封装包括管芯，布线板，多个金属接合线，多个焊球和封装体。 布线板具有管芯安装面，具有焊球的表面安装面以及管芯安装面与表面安装面之间的侧面。 包装体具有覆盖并布置在布线板的侧表面上的紧固件，用于提高布线板和管芯之间的接合强度并避免分层。 优选地，布线板具有多个用于在成型期间支撑布线板的支撑杆。

公开(公告)号：US20020182773A1

公开(公告)日：2002-12-05

申请号：US09871623

申请日：2001-06-04

Applicant: Walsin Advanced Electronics LTD

Inventor： Chun-Jen Su ,  Chien-Hung Lai ,  Chien-Tsun Lin ,  Chao-Chia Chang

IPC: H01L023/495 ,  H01L023/48 ,  H01L021/44 ,  H01L021/48 ,  H01L021/50

CPC classification number: H01L23/49558 ,  H01L23/49531 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method for bonding inner leads of lead frame to substrate includes the steps of: (a) providing a substrate, the substrate having a plurality of connection pads formed on the electrical bonding surface of the substrate; (b) providing a lead frame with a dam tape adhered on of the inner leads of the lead frame; (c) thermally compressing the inner leads of lead frame onto the substrate, wherein a solder material is formed between the inner end and the corresponding connection pad of the substrate and the solder material is limited by the dam tape during inner lead bonding, so that there is stable electrical and mechanical connection between inner leads and the substrate.

Abstract translation: 引线框架的内引线与衬底的接合方法包括以下步骤：（a）提供衬底，所述衬底具有形成在衬底的电接合表面上的多个连接焊盘; （b）提供具有粘附在引线框架的内引线上的阻尼带的引线框架; （c）将引线框架的内部引线热压到基板上，其中在内部端部和相应的基板连接焊盘之间形成焊料材料，并且焊接材料在内部引线接合期间被阻挡带限制，使得 内部引线与基板之间电气和机械连接稳定。