公开(公告)号：US11631795B2

公开(公告)日：2023-04-18

申请号：US16486341

申请日：2018-02-16

Applicant: Wake Forest University

Inventor： David L. Carroll ,  Chaochao Dun ,  Corey Hewitt ,  Robert Summers

IPC: B32B5/16 ,  B82Y30/00 ,  H01L35/26 ,  C01B19/00 ,  H01L35/34

Abstract: Composite nanoparticle compositions and associated nanoparticle assemblies are described herein which, in some embodiments, exhibit enhancements to one or more thermoelectric properties including increases in electrical conductivity and/or Seebeck coefficient and/or decreases in thermal conductivity. In one aspect, a composite nanoparticle composition comprises a semiconductor nanoparticle including a front face and a back face and sidewalls extending between the front and back faces. Metallic nanoparticles are bonded to at least one of the sidewalls establishing a metal-semiconductor junction.