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公开(公告)号:US20210408070A1
公开(公告)日:2021-12-30
申请号:US16630480
申请日:2019-11-08
Inventor: Hanchen LIU
IPC: H01L27/12
Abstract: An array substrate and a method for fabricating same are provided. Base on the existing process, the order of forming the coating film of the thin film transistor and forming the photoresist are adjusted. Thus, a patterning treatment can be directly performed on the first coating film, such that an etching process on the first coating film in the later can be avoided. Therefore, the etching process in the patterning treatment can be omitted, the fabrication process can be simplified, the production efficiency of the product can be improved, and the cost can be reduced.
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公开(公告)号:US20210408077A1
公开(公告)日:2021-12-30
申请号:US16770622
申请日:2020-03-18
Inventor: Hanchen LIU
IPC: H01L27/12 , H01L29/786 , G02F1/1362
Abstract: The disclosure provides a photo-etching compensation structure of an array substrate, including a substrate, a base layer, a light-sensitive layer, and a photo-etching compensation pattern layer disposed between the substrate and the base layer. The photo-etching compensation pattern layer includes a plurality of compensation patterns distributed in an array arrangement, and the compensation patterns change a thickness of the base layer along a thickness direction of the substrate, thereby making a thickness of the light-sensitive layer in an area corresponding to the compensation patterns less than a thickness of the light-sensitive layer in a corresponding area around the compensation patterns.
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