公开(公告)号：US20250102863A1

公开(公告)日：2025-03-27

申请号：US18566067

申请日：2023-10-31

Applicant: WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.

Inventor： Xinpei HU ,  Hailong PAN ,  Guangkun LIU ,  Fancheng LIU ,  Guowei ZHA

IPC: F21V8/00

Abstract: A backlight module and a display device are provided in the present application. In the backlight module, a light modulation surface of the annular light modulation portion is connected to an end of a corresponding light incident surface away from a physical center, and in a direction from the physical center to the annular light modulation portion, a degree of an acute angle between the light modulation surface and the light incident surface is sequentially increased; or, a light modulation surface corresponding to the annular light modulation portion is connected to an end of a corresponding light incident surface near the physical center, and in the direction from the physical center to the annular light modulation portion, the degree of the acute angle between the light modulation surface and the light incident surface is sequentially increased.

公开(公告)号：US20240387563A1

公开(公告)日：2024-11-21

申请号：US17597235

申请日：2021-12-24

Applicant: WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.

Inventor： Hailong PAN

IPC: H01L27/12 ,  G02F1/1362

Abstract: A display panel (100), comprising a driving chip (201) and bonding pad groups (202), which are electrically connected to each other, and an array substrate (10) and a color filter (30), which are arranged opposite each other, wherein the array substrate (10) comprises a first area (A1) and a second area (A2), which are arranged in a first direction (D1); the driving chip (201) is located in a third area (A3), which corresponds to an opening (301) in the color filter (30) on the side of the array substrate (10) that is close to the color filter (30); and the orthographic projection of the driving chip (201) overlaps the orthographic projection of the bonding pad group (202) on a first plane parallel to the first direction (D1) and perpendicular to the display panel (100).

公开(公告)号：US20210294137A1

公开(公告)日：2021-09-23

申请号：US16625795

申请日：2019-08-02

Applicant: Wuhan China Star Optoelectronics Technology Co., Ltd.

Inventor： Hailong PAN ,  Chao WANG

IPC: G02F1/1345 ,  G02F1/1339

Abstract: A display device and a manufacturing method of the display device are provided. The display device includes a first substrate, and a flip chip film. The first substrate is provided with bonding pins, conductive adhesive layers, and barriers. Each bonding pin is extended to a side edge of the first substrate, and each bonding pin includes a connecting surface which is flush with the side edge of the first substrate. Each conductive adhesive layer covers one side of each bonding pin, each conductive adhesive layer is extended to the side edge of the first substrate, and the conductive adhesive layer includes an auxiliary connecting surface which is flush with the side edge of the first substrate. Each barrier surrounds side surfaces of each conductive adhesive layer. The flip chip film is connected to the connecting surface and the auxiliary connecting surface.