公开(公告)号：US20140214354A1

公开(公告)日：2014-07-31

申请号：US14165567

申请日：2014-01-27

申请人： Verayo, Inc.

发明人： Henry Nardus Dreifus ,  Meng-Day Mandel Yu

IPC分类号： G01R31/26

CPC分类号： G01R31/2856

摘要： The invention described here enables in-operation, low-cost, non-invasive measurement of component performance and condition for assessing device longevity prediction, resilience and reliability. The non-invasive component measurements to be performed and subsequently evaluated are based on at least a set of physically unclonable functions and other measurements which can be error corrected, and the error correction factor and other measurements provides insight to the device condition. The system as well is adaptive and allows the introduction of new measurements across not only similar components but to include the family of components similarly fabricated.

摘要翻译： 这里描述的发明使得能够在组件性能和成本方面进行低成本，非侵入性测量以评估设备寿命预测，弹性和可靠性。 要执行和随后评估的非侵入性组件测量基于至少一组可以被纠错的物理不可克隆功能和其他测量，并且误差校正因子和其他测量提供了对设备状况的洞察。 该系统也是适应性的，并且允许不仅引入类似组件的新测量，而且包括类似制造的组件系列。