公开(公告)号：US09488012B2

公开(公告)日：2016-11-08

申请号：US14103184

申请日：2013-12-11

Applicant: Varel International Ind., L.P.

Inventor： Gary M. Thigpen

IPC: E21B10/54 ,  E21B10/633 ,  E21B10/62

CPC classification number: E21B10/633 ,  E21B10/54 ,  E21B10/62 ,  Y10T29/49826

Abstract: A cutter pocket, a downhole tool formed with at least one cutter pocket, and a method for coupling a cutter to the cutter pocket is described herein. The cutter pocket is formed within at least one blade of the downhole tool and includes a pocket back fabricated from a first material, a first pocket side extending from one end of the pocket back to a leading edge of the downhole tool, and a second pocket side extending from an opposing end of the pocket back to the leading edge. The pocket back and the pocket sides define a cavity. A cutter is positioned and coupled at least partially within the cavity. The height of an upper surface of the first material of the pocket back ranges between thirty percent to sixty-five percent of the cutter girth.

Abstract translation: 这里描述了切割器凹槽，形成有至少一个切割器凹穴的井下工具以及用于将切割器联接到切割器凹槽的方法。 切割器袋形成在井下工具的至少一个叶片内，并且包括由第一材料制成的袋背，从袋的一端延伸到井下工具的前缘的第一袋侧，以及第二袋 侧面从口袋的相对端延伸回前缘。 口袋背部和口袋侧面限定一个空腔。 刀具定位并至少部分地连接在腔内。 口袋背部的第一材料的上表面的高度在切割器周长的百分之三十到百分之六十五之间。

公开(公告)号：US09708858B2

公开(公告)日：2017-07-18

申请号：US13924418

申请日：2013-06-21

Applicant: Varel International Ind., L.P.

Inventor： William W. King ,  Gary M. Thigpen ,  Federico Bellin ,  Marvin Windsor Amundsen ,  Charles Daniel Johnson

IPC: E21B10/573 ,  E21B10/567

CPC classification number: E21B10/573 ,  E21B10/567

Abstract: A repaired polycrystalline diamond cutter and method for fabricating the same. The cutter includes a damaged substrate that includes at least one void therein, a polycrystalline diamond table coupled to the damaged substrate, and a build-up compound disposed within the voids formed about the damaged substrate. The damaged substrate and the build-up compound collectively form a full circumference. The method includes obtaining a damaged cutter that includes a polycrystalline diamond table coupled to a damaged substrate having at least one void formed therein, bonding a build-up compound within the at least one void and forming a processed PDC cutter, and removing a portion of the build-up compound from the processed PDC cutter and forming the repaired cutter.