System and method for laser marking substrates

    公开(公告)号:US11192389B2

    公开(公告)日:2021-12-07

    申请号:US16465917

    申请日:2017-12-01

    Abstract: A laser marking system comprises at least one controller to control an array of optical devices, between a laser source and a scan head. The array applies a selected pattern of portions of the received spatial profile of the laser beam to the substrate to achieve a second intensity different from the first intensity of laser beam at a rate of power deposition relative to a rate of thermal diffusion in the substrate for a predetermined time interval to thermally heat locations of the substrate with the selected pattern of the portions. The second intensity effectuates carbonization of materials of the substrate to create a mark without ablation.

    SYSTEM AND METHOD FOR LASER MARKING SUBSTRATES

    公开(公告)号:US20200079108A1

    公开(公告)日:2020-03-12

    申请号:US16465917

    申请日:2017-12-01

    Abstract: A laser marking system comprises at least one controller to control an array of optical devices, between a laser source and a scan head. The array applies a selected pattern of portions of the received spatial profile of the laser beam to the substrate to achieve a second intensity different from the first intensity of laser beam at a rate of power deposition relative to a rate of thermal diffusion in the substrate for a predetermined time interval to thermally heat locations of the substrate with the selected pattern of the portions. The second intensity effectuates carbonization of materials of the substrate to create a mark without ablation.

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