THERMAL CONDITIONING CIRCUIT
    1.
    发明公开

    公开(公告)号:US20240157762A1

    公开(公告)日:2024-05-16

    申请号:US18550296

    申请日:2022-03-15

    IPC分类号: B60H1/00

    摘要: The invention relates to a thermal conditioning system including a refrigerant circuit having: a main loop including in succession: a compression device, a condenser configured to exchange heat with a first heat transfer fluid, a first expansion device, a first evaporator, a bypass branch including a second expansion device and a second evaporator. The second expansion device is a thermostatic expansion valve configured to vary a flow area for the refrigerant between a minimum flow area and a maximum flow area. The bypass branch includes a flow restriction device configured to limit a flow area for the refrigerant to a value less than the maximum flow area of the second expansion device.