公开(公告)号：US20240191396A1

公开(公告)日：2024-06-13

申请号：US18285099

申请日：2022-03-31

申请人： University of Copenhagen ,  Danmarks Tekniske Universitet

发明人： Joachim Elbeshausen Sestoft ,  Thomas Kanne Nordqvist ,  Mikelis Marnauza ,  Aske Nørskov Gejl ,  Dags Olsteins ,  Kasper Grove-Rasmussen ,  Jesper Nygård

IPC分类号： C30B29/60 ,  C30B11/12 ,  C30B29/40 ,  C30B29/66 ,  H01L29/06 ,  H01L29/20 ,  H01L29/66 ,  H01L29/76 ,  H01L31/0352 ,  H01L33/06 ,  H10N60/12

CPC分类号： C30B29/605 ,  C30B11/12 ,  C30B29/40 ,  C30B29/66 ,  H01L29/0665 ,  H01L29/20 ,  H01L29/66977 ,  H01L29/7613 ,  H01L31/035227 ,  H01L33/06 ,  H10N60/12

摘要： The present disclosure relates to a method of manufacturing a transferable lamella comprising interconnected nanostructures, the method comprising the steps of: a) providing a substrate such as a planar substrate; b) forming at least one superstructure on the substrate, said superstructure comprising a plurality of elongated nanostructures (formed e.g. by growth, deposition, and/or etching); wherein the elongated nanostructures are formed such that at least two of said nanostructures are conductively interconnected, and/or wherein at least a first layer is grown or deposited to conductively interconnect or insulate at least a part of the elongated nanostructures; c) encapsulating at least a portion of said superstructure in an encapsulating material, said portion comprising at least two interconnected nanostructures; and d) cutting the encapsulating material in a direction that intersects at least two interconnected nanostructures, thereby manufacturing a transferable lamella comprising interconnected nanostructures. The present disclosure further relates to an electronic device manufactured from one or more of the lamellas provided by the method.