公开(公告)号：US20220268667A1

公开(公告)日：2022-08-25

申请号：US17634144

申请日：2020-08-21

申请人： UPL LTD

发明人： Mani Elangovan ,  Vinod Madurai Sathyanarayana

IPC分类号： G01N1/06 ,  A01C1/02 ,  A01C1/04

摘要： The present disclosure provides a seed slicer device (100), which includes: a first plate (102) provided with first holes (104); a second plate (106) provided with second holes (108), adapted to fit over the first plate; a sliding plate (110) slidably coupled to a top portion of the second plate, operable to cover the second holes; a third plate (112) provided with a third holes (114), adapted to fit over the second plate; and a cutting assembly (116) coupled to the third plate and adapted to slide over the third holes to provide a slicing action. The seeds are received by the third holes such that at least a first part of the seeds extend beyond the third holes, and, upon actuation of the cutting assembly, the seeds are cut by the cutting means to divide the seeds into corresponding first parts and second parts.