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1.
公开(公告)号:US10189700B2
公开(公告)日:2019-01-29
申请号:US15278359
申请日:2016-09-28
申请人: U.S.A. as represented by the Administrator of the National Aeronautics and Space Administration
摘要: An integrated circuit (IC) chip with a self-contained fluid sensor and method of making the chip. The sensor is in a conduit formed between a semiconductor substrate and a non-conductive cap with fluid entry and exit points through the cap. The conduit may be entirely in the cap, in the substrate or in both. The conduit includes encased temperature sensors at both ends and a central encased heater. The temperature sensors may each include multiple encased diodes and the heater may include multiple encased resistors.