公开(公告)号：US11485043B2

公开(公告)日：2022-11-01

申请号：US16479181

申请日：2018-01-17

申请人： Tsinghua University

发明人： Feng Lin ,  Bin Zhou ,  Wentao Yan ,  Hongxin Li ,  Lei Zhang ,  Ting Zhang ,  Chao Guo

IPC分类号： B28B1/00 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y40/20 ,  B23K15/00 ,  B23K15/06 ,  B23K15/08 ,  B22F10/20 ,  B22F10/32 ,  B22F10/36 ,  B22F10/00 ,  B22F12/45 ,  B22F10/28 ,  B22F12/50 ,  B33Y10/00 ,  H01J37/04 ,  B22F10/30

摘要： An additive manufacturing apparatus utilizing combined electron beam selective melting and electron beam cutting. One electron beam emitting, focusing, and scanning device (6) is capable of emitting electron beams (67, 68) in three modes of heating, selective melting, and electron beam cutting. The electron beam in the heating mode is emitted to scan and preheat a powder bed (7). The electron beam (67) in the selective melting mode is emitted to scan and melt powder (71) in a section outline to form a section layer of a component. The electron beam (68) in the electron beam cutting mode is emitted to perform one or more cutting scans on inner and outer outlines (74, 75) of a section of the component to obtain accurate and smooth inner and outer outlines of the section. The heating, melting deposition, and outline cutting processes are repeated to obtain a required three-dimensional physical component.

公开(公告)号：US11192187B2

公开(公告)日：2021-12-07

申请号：US15556797

申请日：2016-03-09

申请人： Tsinghua University

发明人： Feng Lin ,  Bin Zhou ,  Chao Guo ,  Wenjun Ge ,  Lei Zhang

IPC分类号： B22F10/20 ,  B29C64/153 ,  B28B1/00 ,  B29C64/371 ,  H01J37/22 ,  B33Y30/00 ,  B23K26/082 ,  B23K26/12 ,  B23K26/342 ,  B23K15/00 ,  B23K26/046 ,  B28B17/00 ,  B22F10/30 ,  B33Y50/02

摘要： An additive manufacturing device utilizing an electron beam and laser integrated scanning comprises: a vacuum generating chamber (1); a worktable means having a forming region at least provided in the vacuum generating chamber (1); a powder supply means configured to supply a powder to the forming region; an electron-beam emission focusing and scanning means (6) and an laser-beam emission focusing and scanning means (7) configured in such a manner that a scanning range of the electron-beam emission focusing and scanning means (6) and a scanning range of the laser-beam emission focusing and scanning means (7) cover at least a part of the forming region; and a controller configured to control the electron-beam emission focusing and scanning means (6) and the laser-beam emission focusing and scanning means (7) to perform a powder integrated-scanning and forming treatment on the forming region.