公开(公告)号：US20140233239A1

公开(公告)日：2014-08-21

申请号：US13941330

申请日：2013-07-12

Applicant: Toshiba Lighting & Technology Corporation

Inventor： Ryotaro MATSUDA ,  Masazumi ISHIDA ,  Junichi KIMIYA ,  Jun SASAKI

IPC: F21V1/16 ,  F21V29/00

CPC classification number: F21V1/16 ,  F21K9/20 ,  F21K9/90 ,  F21V29/506 ,  F21V29/70 ,  F21V29/763 ,  F21V29/89 ,  F21Y2105/00 ,  F21Y2115/20 ,  H01L25/0753 ,  H01L2924/0002 ,  Y10T29/49002 ,  H01L2924/00

Abstract: According to one embodiment, a light-emitting module includes a substrate, a cover, a frame body, and a resin layer. A light-emitting section including a light-emitting element is provided on the substrate. The cover has translucency and is opposed to the light-emitting section. The frame body is interposed between the substrate and the cover around the light-emitting section. The resin layer has translucency and is interposed between the light-emitting section and the cover while being set in contact with the light-emitting section and the cover.

Abstract translation: 根据一个实施例，发光模块包括基板，盖，框架体和树脂层。 在基板上设置包括发光元件的发光部。 该盖具有半透明性并且与发光部相对。 框架主体介于基板和围绕发光部分的盖子之间。 树脂层具有半透明性，并且与发光部和盖接触地设置在发光部和盖之间。