公开(公告)号：US11373884B2

公开(公告)日：2022-06-28

申请号：US16866232

申请日：2020-05-04

Applicant: Tokyo Electron Limited

Inventor： Dai Kitagawa ,  Katsuyuki Koizumi ,  Tsutomu Nagai ,  Daisuke Hayashi ,  Satoru Teruuchi

IPC: H01L21/67 ,  H01J37/32 ,  H01L21/683

Abstract: A placing table on an embodiment includes a supporting member and a base. The supporting member includes a placing region provided with a heater, and an outer peripheral region surrounding the placing region. The base includes a first region supporting the placing region thereon, and a second region surrounding the first region. In the second region, through holes are formed. Wirings electrically connected to the heater passes through the through holes of the second region.

公开(公告)号：US10699883B2

公开(公告)日：2020-06-30

申请号：US15309399

申请日：2015-06-01

Applicant: TOKYO ELECTRON LIMITED

Inventor： Satoru Teruuchi

IPC: H01J37/32 ,  H05H1/46 ,  H01L21/02 ,  H01L21/3065 ,  H01L21/67 ,  H05B3/28 ,  F27D11/02 ,  H01L21/683 ,  H05B3/62

Abstract: A plasma processing apparatus according to an embodiment includes a processing container, a mounting table, a plurality of heaters, and a power supply device. The mounting table is provided in the processing container. The plurality of heaters are provided in the mounting table. The power supply device supplies electric power to the plurality of heaters. The power supply device includes a plurality of transformers and a plurality of zero-cross control type solid state relays (SSRs). The plurality of transformers are configured to step down a voltage from an alternating-current power source. Each of the plurality of transformers includes a primary coil and a secondary coil. The primary coil is connected to the alternating-current power source. Each of the plurality of SSRs is provided between one corresponding heater among the plurality of heaters and the secondary coil of one corresponding transformer among the plurality of transformers.

公开(公告)号：US12142501B2

公开(公告)日：2024-11-12

申请号：US17484914

申请日：2021-09-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kenichiro Yamada ,  Satoru Teruuchi ,  Kenichiro Nakamura ,  Takari Yamamoto

IPC: H01L21/67 ,  C23C16/46 ,  C23C16/50 ,  C23C16/509 ,  C23C16/52 ,  H01J37/32 ,  H01L21/683 ,  H05B1/02

Abstract: A substrate processing system includes a substrate processing apparatus and a control device. The substrate processing apparatus includes a chamber, and a placing table provided inside the chamber. The placing table places a substrate thereon, and includes a base and an electrostatic chuck provided on an upper surface of the base. The electrostatic chuck has a plurality of division regions each provided with a heater therein. The substrate processing system also includes a control device that includes a measuring unit that measures a resistance value of the heater for each of the division regions, an estimating unit that estimates a temperature of each of the division regions based on the resistance value of the heater measured by the measuring unit, and a power controller that controls a power supplied to the heater for each of the division regions based on the temperature estimated by the estimating unit.

公开(公告)号：US10679869B2

公开(公告)日：2020-06-09

申请号：US15308686

申请日：2015-06-01

Applicant: TOKYO ELECTRON LIMITED

Inventor： Dai Kitagawa ,  Katsuyuki Koizumi ,  Tsutomu Nagai ,  Daisuke Hayashi ,  Satoru Teruuchi

IPC: H01L21/67 ,  H01J37/32 ,  H01L21/683

Abstract: A placing table on an embodiment includes a supporting member and a base. The supporting member includes a placing region provided with a heater, and an outer peripheral region surrounding the placing region. The base includes a first region supporting the placing region thereon, and a second region surrounding the first region. In the second region, through holes are formed. Wirings electrically connected to the heater passes through the through holes of the second region.