公开(公告)号：US20210111050A1

公开(公告)日：2021-04-15

申请号：US16496378

申请日：2018-03-12

Applicant: TOKYO ELECTRON LIMITED

Inventor： Norihiko TSUJI ,  Atsushi KAWABE ,  Hiroki OKA

IPC: H01L21/677 ,  H01L21/67

Abstract: A substrate processing device includes a transfer chamber configured to transfer a substrate under an atmospheric atmosphere and a plurality of processing units each including at least one processing chamber for processing the substrate under a vacuum atmosphere and at least one load-lock chamber connected to the processing chamber to switch an inner atmosphere thereof between the atmospheric atmosphere and the vacuum atmosphere. The transfer chamber includes a connection unit configured to connect the transfer chamber and the load-lock chamber such that each of the processing units is detachably attached. The connection unit includes an opening that allows the transfer chamber to communicate with the load-lock chamber, and an opening/closing mechanism configured to open and close the opening portion.

公开(公告)号：US20190355604A1

公开(公告)日：2019-11-21

申请号：US16407509

申请日：2019-05-09

Applicant: TOKYO ELECTRON LIMITED

Inventor： Atsushi KAWABE

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/68 ,  H01L23/544 ,  B65G47/90

Abstract: A substrate transfer method includes: acquiring sensing information from a sensor by moving a substrate by a robot arm such that the substrate passes through a sensing region; calculating a center position of the substrate with respect to the robot arm based on the sensing information; detecting a marker indicating a reference direction of the substrate by the sensor by controlling the robot arm to rotate the substrate about the center position in a state where an edge of the substrate is located in the sensing region; calculating a direction of the substrate with respect to the robot arm based on a position of the marker; calculating a correction amount based on the center position and the direction of the substrate; and placing the substrate on the stage in the processing chamber such that the center position and the direction of the substrate are corrected according to the correction amount.

公开(公告)号：US20220037176A1

公开(公告)日：2022-02-03

申请号：US17298768

申请日：2019-11-19

Applicant: Tokyo Electron Limited

Inventor： Akira TAKAHASHI ,  Atsushi KAWABE

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/68

Abstract: Provided is a transfer detection method for use in a substrate processing apparatus including a transfer arm, which has a plurality of substrate holders and is configured to transfer a plurality of substrates to a plurality of stages between a first chamber and a second chamber adjacent to the first chamber by using the plurality of substrate holders, and an optical sensor provided in a vicinity of an opening via which the first and second chambers are in communication with each other, the method including: projecting a light beam having a horizontal optical axis parallel to the opening to a position through which the substrates held by the plurality of substrate holders pass; and determining at least one of a state of the substrates on the substrate holders and a state of the transfer arm, in response to a detection result of the light beam projected from the optical sensor.

公开(公告)号：US20180286729A1

公开(公告)日：2018-10-04

申请号：US15938453

申请日：2018-03-28

Applicant: TOKYO ELECTRON LIMITED

Inventor： Atsushi KAWABE ,  Keisuke KONDOH

IPC: H01L21/677 ,  B65G47/90 ,  H01L21/67

Abstract: A system includes a transfer device for transferring workpieces in an atmospheric atmosphere, a transfer unit for transferring the workpieces in a vacuum atmosphere, and a vacuum processing unit including vacuum process chambers connected to the transfer unit and for performing a process on the workpieces in each process chamber. The vacuum processing unit simultaneously performs the process on the workpieces in each process chamber. The process chambers are arranged along a first direction. The transfer unit includes first and second common transfer devices installed along the first direction to transfer the workpieces along the first direction. The first common transfer device is connected to each process chamber at a first side in a second direction perpendicular to the first direction, the second common transfer device is connected to each process chamber at a second side in the second direction.