公开(公告)号：US20240227249A9

公开(公告)日：2024-07-11

申请号：US18048327

申请日：2022-10-20

Applicant: The Boeing Company

Inventor： Luke G. Warpinski ,  Michael D. Nevinsky ,  Kenneth W. Young

IPC: B29C33/52 ,  B29C70/34 ,  B32B3/30 ,  B32B7/12

CPC classification number: B29C33/52 ,  B29C70/34 ,  B32B3/30 ,  B32B7/12 ,  B29L2031/3076 ,  B32B2605/18

Abstract: Methods and apparatus for tooling in layered structures for increased joint performance are disclosed. A disclosed example method includes placing a tool onto a first substrate to define an impression in the first substrate, curing the first substrate, removing the tool from the first substrate to define a joint interface corresponding to the impression, and coupling, at the joint interface, the first substrate to a second substrate.

公开(公告)号：US20240383174A1

公开(公告)日：2024-11-21

申请号：US18789131

申请日：2024-07-30

Applicant: The Boeing Company

Inventor： Luke G. Warpinski ,  Michael D. Nevinsky ,  Kenneth W. Young

IPC: B29C33/52 ,  B29C70/34 ,  B29L31/30 ,  B32B3/30 ,  B32B7/12

Abstract: Methods and apparatus for tooling in layered structures for increased joint performance are disclosed. A disclosed example method includes placing a tool onto a first substrate to define an impression in the first substrate, curing the first substrate, removing the tool from the first substrate to define a joint interface corresponding to the impression, and coupling, at the joint interface, the first substrate to a second substrate.

公开(公告)号：US12083714B2

公开(公告)日：2024-09-10

申请号：US18048327

申请日：2022-10-20

Applicant: The Boeing Company

Inventor： Luke G. Warpinski ,  Michael D. Nevinsky ,  Kenneth W. Young

IPC: B32B3/30 ,  B29C33/52 ,  B29C70/34 ,  B32B7/12 ,  B29L31/30

CPC classification number: B29C33/52 ,  B29C70/34 ,  B32B3/30 ,  B32B7/12 ,  B29L2031/3076 ,  B32B2605/18

Abstract: Methods and apparatus for tooling in layered structures for increased joint performance are disclosed. A disclosed example method includes placing a tool onto a first substrate to define an impression in the first substrate, curing the first substrate, removing the tool from the first substrate to define a joint interface corresponding to the impression, and coupling, at the joint interface, the first substrate to a second substrate.

公开(公告)号：US20240131754A1

公开(公告)日：2024-04-25

申请号：US18048327

申请日：2022-10-19

Applicant: The Boeing Company

Inventor： Luke G. Warpinski ,  Michael D. Nevinsky ,  Kenneth W. Young

IPC: B29C33/52 ,  B29C70/34 ,  B32B3/30 ,  B32B7/12

CPC classification number: B29C33/52 ,  B29C70/34 ,  B32B3/30 ,  B32B7/12 ,  B29L2031/3076 ,  B32B2605/18

Abstract: Methods and apparatus for tooling in layered structures for increased joint performance are disclosed. A disclosed example method includes placing a tool onto a first substrate to define an impression in the first substrate, curing the first substrate, removing the tool from the first substrate to define a joint interface corresponding to the impression, and coupling, at the joint interface, the first substrate to a second substrate.