公开(公告)号：US11973017B2

公开(公告)日：2024-04-30

申请号：US17506156

申请日：2021-10-20

Applicant: Texas Instruments Incorporated

Inventor： Jaimal Mallory Williamson ,  Jim C Lo

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49894 ,  H01L21/4857 ,  H01L23/3121 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/08 ,  H01L24/16 ,  H01L2224/08235 ,  H01L2224/16227

Abstract: A multilayer package substrate includes a plurality of dielectric layers including a top dielectric layer on a top side and a bottom dielectric layer on a bottom side. A top patterned metal layer is on the top dielectric layer and a bottom patterned metal layer is on the bottom dielectric layer. At least one of the top dielectric layer and the bottom dielectric layer is a porous dielectric layer having a plurality of pores including an average porosity of at least 5% averaged over its thickness.