-
公开(公告)号：US20200043825A1
公开(公告)日：2020-02-06
申请号：US16267907
申请日：2019-02-05
Applicant: Texas Instruments Incorporated
IPC: H01L23/367 , H01L23/498 , H01L23/00 , H01L21/48
Abstract: A hermetic ceramic package for high current signals includes a substrate made of a plurality of ceramic green sheets that form an upper body portion having an upper surface and a lower body portion having a lower surface and an intermediate surface between the upper surface and the lower surface. A first conductive plate is formed on the intermediate surface and a first plurality of conductive pad vias are formed in the lower body portion, extending from the first conductive plate to the lower surface of the lower body portion. A heat sink if coupled to the lower surface of the lower body portion and a first conductive pad also coupled to the lower surface such that the first conductive pad is electrically coupled to the first plurality of conductive pad vias.
-
公开(公告)号：US11088047B2
公开(公告)日：2021-08-10
申请号：US16267907
申请日：2019-02-05
Applicant: Texas Instruments Incorporated
IPC: H01L23/367 , H01L23/498 , H01L23/00 , H01L21/48
Abstract: A hermetic ceramic package for high current signals includes a substrate made of a plurality of ceramic green sheets that form an upper body portion having an upper surface and a lower body portion having a lower surface and an intermediate surface between the upper surface and the lower surface. A first conductive plate is formed on the intermediate surface and a first plurality of conductive pad vias are formed in the lower body portion, extending from the first conductive plate to the lower surface of the lower body portion. A heat sink if coupled to the lower surface of the lower body portion and a first conductive pad also coupled to the lower surface such that the first conductive pad is electrically coupled to the first plurality of conductive pad vias.
-
Search Results
2
records
(took 0.011 seconds)
