公开(公告)号：US20230045422A1

公开(公告)日：2023-02-09

申请号：US17678774

申请日：2022-02-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Li-Hsien Huang ,  Yao-Chun Chuang ,  SyuFong Li ,  Ching-Pin Lin ,  Jun He

IPC: H01L23/00 ,  H01L21/66 ,  H01L21/683 ,  H01L23/48

Abstract: In an embodiment, a method includes attaching a first package component to a first carrier, the first package component comprising: an aluminum pad disposed adjacent to a substrate; a sacrificial pad disposed adjacent to the substrate, the sacrificial pad comprising a major surface opposite the substrate, a protrusion of the sacrificial pad extending from the major surface; and a dielectric bond layer disposed around the aluminum pad and the sacrificial pad; attaching a second carrier to the first package component and the first carrier, the first package component being interposed between the first carrier and the second carrier; removing the first carrier; planarizing the dielectric bond layer to comprise a top surface being coplanar with the protrusion; and etching a portion of the protrusion.

公开(公告)号：US11984422B2

公开(公告)日：2024-05-14

申请号：US17678774

申请日：2022-02-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Li-Hsien Huang ,  Yao-Chun Chuang ,  SyuFong Li ,  Ching-Pin Lin ,  Jun He

IPC: H01L21/683 ,  H01L21/66 ,  H01L23/00 ,  H01L23/48

CPC classification number: H01L24/27 ,  H01L21/6835 ,  H01L22/14 ,  H01L23/481 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/30 ,  H01L2224/0384 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/06515 ,  H01L2224/275 ,  H01L2224/30181 ,  H01L2924/30105 ,  H01L2924/35121 ,  H01L2924/37001

Abstract: In an embodiment, a method includes attaching a first package component to a first carrier, the first package component comprising: an aluminum pad disposed adjacent to a substrate; a sacrificial pad disposed adjacent to the substrate, the sacrificial pad comprising a major surface opposite the substrate, a protrusion of the sacrificial pad extending from the major surface; and a dielectric bond layer disposed around the aluminum pad and the sacrificial pad; attaching a second carrier to the first package component and the first carrier, the first package component being interposed between the first carrier and the second carrier; removing the first carrier; planarizing the dielectric bond layer to comprise a top surface being coplanar with the protrusion; and etching a portion of the protrusion.

公开(公告)号：US20240258263A1

公开(公告)日：2024-08-01

申请号：US18631900

申请日：2024-04-10

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Li-Hsien Huang ,  Yao-Chun Chuang ,  SyuFong Li ,  Ching-Pin Lin ,  Jun He

IPC: H01L23/00 ,  H01L21/66 ,  H01L21/683 ,  H01L23/48

CPC classification number: H01L24/27 ,  H01L21/6835 ,  H01L22/14 ,  H01L23/481 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/30 ,  H01L2224/0384 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/06515 ,  H01L2224/275 ,  H01L2224/30181 ,  H01L2924/30105 ,  H01L2924/35121 ,  H01L2924/37001

Abstract: In an embodiment, a method includes attaching a first package component to a first carrier, the first package component comprising: an aluminum pad disposed adjacent to a substrate; a sacrificial pad disposed adjacent to the substrate, the sacrificial pad comprising a major surface opposite the substrate, a protrusion of the sacrificial pad extending from the major surface; and a dielectric bond layer disposed around the aluminum pad and the sacrificial pad; attaching a second carrier to the first package component and the first carrier, the first package component being interposed between the first carrier and the second carrier; removing the first carrier; planarizing the dielectric bond layer to comprise a top surface being coplanar with the protrusion; and etching a portion of the protrusion.