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公开(公告)号：US11851325B2
公开(公告)日：2023-12-26
申请号：US16695673
申请日：2019-11-26
发明人： Chien-Wei Chang , Ya-Jen Sheuh , Ren-Dou Lee , Yi-Chih Chang , Yi-Hsun Chiu , Yuan-Hsin Chi
IPC分类号： B81C1/00 , H01L21/3105 , H01L21/02 , H01L21/66
CPC分类号： B81C1/00238 , H01L21/02274 , H01L21/31053 , H01L22/12
摘要： Methods for improving wafer bonding performance are disclosed herein. In some embodiments, a method for bonding a pair of semiconductor substrates is disclosed. The method includes: processing at least one of the pair of semiconductor substrates, and bonding the pair of semiconductor substrates together. Each of the pair of semiconductor substrates is processed by: performing at least one chemical vapor deposition (CVD), and performing at least one chemical mechanical polishing (CMP). One of the at least one CVD is performed after all CMP performed before bonding.
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公开(公告)号：US20190091829A1
公开(公告)日：2019-03-28
申请号：US15994088
申请日：2018-05-31
发明人： Cheng-Ping Chen , Ren-Dou Lee , Sheng-Tai Peng , Tsung-Lung Lai , Tzi-Yi Shieh , Chien-Wei Chang
IPC分类号： B24B37/32 , H01L21/321 , B24B37/015 , B24B37/20
摘要： In some embodiments, the present disclosure, in some embodiments, relates to a method of forming a CMP membrane. The method is performed by providing a malleable material within a cavity within a membrane mold. The cavity has a central region and a peripheral region surrounding the central region. The malleable material within the cavity is cured to form a membrane. Curing the malleable material is performed by heating the malleable material within the central region of the membrane mold to a first temperature and heating the malleable material within the peripheral region of the membrane mold to a second temperature that is greater than the first temperature.
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公开(公告)号：US11267099B2
公开(公告)日：2022-03-08
申请号：US15994088
申请日：2018-05-31
发明人： Cheng-Ping Chen , Ren-Dou Lee , Sheng-Tai Peng , Tsung-Lung Lai , Tzi-Yi Shieh , Chien-Wei Chang
IPC分类号： B24B37/32 , B24B37/20 , B24B37/015 , H01L21/321
摘要： In some embodiments, the present disclosure, in some embodiments, relates to a method of forming a CMP membrane. The method is performed by providing a malleable material within a cavity within a membrane mold. The cavity has a central region and a peripheral region surrounding the central region. The malleable material within the cavity is cured to form a membrane. Curing the malleable material is performed by heating the malleable material within the central region of the membrane mold to a first temperature and heating the malleable material within the peripheral region of the membrane mold to a second temperature that is greater than the first temperature.
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