公开(公告)号：US09761468B2

公开(公告)日：2017-09-12

申请号：US14182021

申请日：2014-02-17

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Yuh-Sen Chang ,  Shang-Hsien Lin ,  Chih-Yang Chan ,  Szu-Hsien Lee ,  Chia-Haw Yeh

IPC分类号： H01L21/67 ,  H01L21/31

CPC分类号： H01L21/67132 ,  H01L21/67092 ,  Y10T156/108 ,  Y10T156/1343 ,  Y10T156/1705

摘要： In accordance with some embodiments, a wafer taping device is provided. The wafer taping device includes a tape delivering along a first direction. The wafer taping device also includes a wafer mount unit disposed below the tape. The wafer mount unit has an upper surface for supporting a wafer and having a notch for allowing a cut mark of the wafer to align with it. The notch is staggered with a second direction in the upper surface, and the second direction is substantially perpendicular to the first direction. In addition, the wafer taping device includes a laminating roller disposed above the wafer mount unit and having a long axis elongated in the second direction. The laminating roller is configured to reciprocate along the first direction for pressing the tape to the wafer.