Patent search ap:("TUNG SOL ELECTRIC INC") AND inv:"CHAMBERLIN RAYMOND G" Page 1

1.

发明授权
Encapsulation of electronic component and method of making the same 失效
Title translation: 电子元件封装及其制作方法

公开(公告)号：US2941688A

公开(公告)日：1960-06-21

申请号：US70644357

申请日：1957-12-31

Applicant: TUNG SOL ELECTRIC INC

Inventor： CHAMBERLIN RAYMOND G , EVANDER HERBERT S

IPC: H01J5/28 , H01L23/045

CPC classification number: H01L23/045 , H01J5/28 , H01J2893/0044 , H01L2924/0002 , H01L2924/00

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