公开(公告)号：US20240153977A1

公开(公告)日：2024-05-09

申请号：US18413192

申请日：2024-01-16

Applicant: TOPPAN Inc.

Inventor： Koei OTSUKA

IPC: H01L27/146

CPC classification number: H01L27/14627 ,  H01L27/14621

Abstract: A solid-state imaging device includes a wafer substrate having photoelectric conversion elements, a filter part formed on the wafer substrate and having color filters positioned in correspondence with the photoelectric conversion elements, and a microlens part including a non-photosensitive resin and having microlenses positioned in correspondence with the color filters. The microlenses are positioned with a gap between two microlenses adjacent to each other in a diagonal direction of a square region in which the color filters are positioned and with a gap between two microlenses adjacent to each other in a direction in which a side of the square region extends.