公开(公告)号：US11718587B2

公开(公告)日：2023-08-08

申请号：US16648585

申请日：2018-09-26

Applicant: TOKYO OHKA KOGYO CO., LTD. ,  Daicel Corporation

Inventor： Kunihiro Noda ,  Hiroki Chisaka ,  Issei Suzuki ,  Jiro Hikida ,  Dai Shiota ,  Kieko Hanano ,  Kyohei Ishida ,  Tsutomu Watanabe ,  Kazuhiro Uehara

IPC: C07D233/60 ,  C07D233/58

CPC classification number: C07D233/60 ,  C07D233/58

Abstract: A novel compound suitable as an epoxy curing catalyst; an epoxy curing catalyst using the compound; and a method for producing the compound. A compound represented by formula (1) in which Xm+ represents an m valent counter cation, R1 represents an aromatic group which may have a substituent; R2 represents an alkylene group which may have a substituent; R3 represents a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfonic acid ester group, a phosphino group, a phosphinyl group, a phosphonic acid ester group or an organic group; m represents an integer of 1 or more; n represents an integer of 0-3; and R2 may bond with R1 to form a cyclic structure.