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公开(公告)号:US11295965B2
公开(公告)日:2022-04-05
申请号:US16188671
申请日:2018-11-13
发明人: Kohei Yamada , Hiroaki Inadomi , Satoshi Biwa
IPC分类号: H01L21/67 , H01L21/02 , H01L21/677 , B08B9/093 , B08B3/02
摘要: A cleaning apparatus of a substrate processing apparatus according to an exemplary embodiment includes a nozzle and a scanner. The nozzle ejects a gas toward in an inner wall surface of a processing chamber in which a substrate is processed. The scanner causes the nozzle to scan along the inner wall surface of the processing chamber in the processing chamber.