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公开(公告)号:US12030126B2
公开(公告)日:2024-07-09
申请号:US17383150
申请日:2021-07-22
发明人: Martin Thuo , Ian Tevis
IPC分类号: B22F9/06
CPC分类号: B22F9/06 , B22F2201/01 , B22F2201/03
摘要: A droplet comprises a core including an alloy comprising a majority of a first metallic element and a minority of a second element, wherein the core is in a liquid state below a solidus temperature of the alloy. A shell is arranged to enclose the core and includes an exterior surface comprising a majority of the second element and a minority of the first metallic element, wherein the shell is in a solid state below the solidus temperature of the alloy. The alloy can comprise a solder material that can be used to form solder connections below a solidus temperature of the alloy.
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公开(公告)号:US20240058861A1
公开(公告)日:2024-02-22
申请号:US18452441
申请日:2023-08-18
发明人: Martin Thuo , Ian Tevis
CPC分类号: B22F1/16 , B22F1/08 , B22F1/17 , B22F1/102 , B23K35/025
摘要: A particle comprises an amorphous solid metallic core enclosed within a metal-oxide shell. The amorphous solid metallic core includes one or more metals and is below a glass transition temperature of the one or more metals. The particle further comprises one or more regions having a crystalline or semi-crystalline structure disposed within the amorphous solid metallic core.
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