公开(公告)号：US20190206806A1

公开(公告)日：2019-07-04

申请号：US15946868

申请日：2018-04-06

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Barry Jon MALE ,  Paul Merle EMERSON ,  Kurt Peter WACHTLER

IPC: H01L23/00 ,  H01L23/34 ,  H01L23/495 ,  H01L23/29

CPC classification number: H01L23/562 ,  H01L23/29 ,  H01L23/345 ,  H01L23/49513 ,  H01L24/46 ,  H01L24/49 ,  H01L2924/14

Abstract: An integrated circuit includes a lead frame, a first die, and a second die. The first die is bonded to and electrically connected to the lead frame. The second die is electrically connected to and spaced apart from the first die.