Abstract:
A woven wire mesh member and method of manufacture are described in which the intersecting wire strands are bonded together and then etched for increasing the transmission characteristics of such mesh. The bonding of the intersecting portions of the wire strands is accomplished by electroplating and insures a strong mesh structure whose wires remain in a fixed position after such etching. The bonded mesh member is etched by electropolishing to uniformly reduce the diameter of the wires and removes the plating layer from the wires except in the regions of such bonds. This electropolishing increases the electron transmission characteristics of the wire mesh, in one example to a transmission of 85 to 90 percent. Such a mesh member may be used as a grid, a collector or a storage target electrode in an electron beam tube.