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    ELECTRONIC COMPONENT
    5.
    发明申请
    ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20170309389A1

    公开(公告)日：2017-10-26

    申请号：US15488876

    申请日：2017-04-17

    申请人： TDK CORPORATION

    发明人： Shinichi SATO ,  Yohei TADAKI ,  Akihiko OIDE ,  Yuma ISHIKAWA ,  Hidekazu SATO ,  Kazuhiro EBINA ,  Hiroyuki TANOUE

    IPC分类号： H01F27/28 ,  H01F27/29 ,  H01F27/32 ,  H01F41/04 ,  H01F41/12

    摘要： An electronic component includes: an element body in which a plurality of insulator layers are stacked; a coil in which a plurality of inner conductors installed in the element body are electrically connected to each other; and an outer electrode that is disposed on an outer surface of the element body, is electrically connected to the coil, and includes at least a baked electrode layer. The inner conductor connected to the outer electrode includes a connection conductor that electrically connects the baked electrode layer to the inner conductor. The connection conductor includes a protruding portion that protrudes from the outer surface of the element body to the outer electrode. The protruding portion includes a metal having a smaller diffusion coefficient than a metal of a main component included in the baked electrode layer. The inner conductors have a lower electric resistance value than the metal included in the protruding portion.

    MULTILAYER COIL COMPONENT
    6.
    发明公开
    MULTILAYER COIL COMPONENT 审中-公开

    公开(公告)号：US20230230737A1

    公开(公告)日：2023-07-20

    申请号：US18151070

    申请日：2023-01-06

    申请人： TDK CORPORATION

    发明人： Yusuke NAGAI ,  Kazuhiro EBINA ,  Kunihiko KAWASAKI ,  Shinichi KONDO ,  Kouichi KAKUDA ,  Shinichi SATO ,  Keito YASUDA

    IPC分类号： H01F5/00 ,  H01F1/20

    CPC分类号： H01F5/003 ,  H01F1/20

    摘要： A multilayer coil component includes: an element body including a plurality of magnetic layers that includes soft magnetic metal particles and is laminated in a first direction; and a coil disposed in the element body. The coil includes a plurality of coil conductors electrically connected to each other. The plurality of magnetic layers includes a first magnetic layer and a second magnetic layer laminated between two coil conductors adjacent to each other in the first direction. An average particle diameter of soft magnetic metal particles included in the second magnetic layer is larger than an average particle diameter of soft magnetic metal particles included in the first magnetic layer.

    MULTILAYER COIL COMPONENT
    9.
    发明申请
    MULTILAYER COIL COMPONENT 审中-公开

    公开(公告)号：US20200303110A1

    公开(公告)日：2020-09-24

    申请号：US16817046

    申请日：2020-03-12

    申请人： TDK CORPORATION

    发明人： Shinichi SATO ,  Takahiro SATO ,  Yusuke NAGAI ,  Mitsuharu KOIKE ,  Kazuhiro MIURA ,  Seiichi NAKAGAWA ,  Shinichi KONDO ,  Takashi SUZUKI

    IPC分类号： H01F17/00 ,  H01F1/24

    摘要： A multilayer coil component includes an element body including a plurality of metal magnetic particles, and a plurality of coil conductors. The plurality of coil conductors is disposed in the element body. The plurality of coil conductors is separated from each other in a predetermined direction and electrically connected to each other. The plurality of coil conductors includes one pair of side surfaces opposing each other in the predetermined direction. Surface roughness of the one pair of side surfaces is less than 40% of an average particle size of the plurality of metal magnetic particles.