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公开(公告)号:US20220299582A1
公开(公告)日:2022-09-22
申请号:US17836016
申请日:2022-06-09
Applicant: TDK CORPORATION
Inventor: Shunji SARUKI , Hiraku HIRABAYASHI , Masanori SAKAI
Abstract: At a reference position within a first plane, a magnetic field to be detected has a first direction that changes within the first plane. A magnetic sensor includes an MR element. The MR element includes a magnetic layer having first magnetization that can change in direction within a second plane. The first plane and the second plane intersect at a dihedral angle α other than 90°. The magnetic field to be detected can be divided into an in-plane component parallel to the second plane and a perpendicular component perpendicular to the second plane. The in-plane component has a second direction that changes with a change in the first direction. The direction of the first magnetization changes with a change in the second direction. A detection value depends on the direction of the first magnetization.
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公开(公告)号:US20230358828A1
公开(公告)日:2023-11-09
申请号:US18223135
申请日:2023-07-18
Applicant: TDK CORPORATION
Inventor: Shunji SARUKI , Hiraku HIRABAYASHI , Masanori SAKAI
CPC classification number: G01R33/098 , G01R33/096 , G01R33/093 , G01R33/0017
Abstract: At a reference position within a first plane, a magnetic field to be detected has a first direction that changes within the first plane. A magnetic sensor includes an MR element. The MR element includes a magnetic layer having first magnetization that can change in direction within a second plane. The first plane and the second plane intersect at a dihedral angle α other than 90°. The magnetic field to be detected can be divided into an in-plane component parallel to the second plane and a perpendicular component perpendicular to the second plane. The in-plane component has a second direction that changes with a change in the first direction. The direction of the first magnetization changes with a change in the second direction. A detection value depends on the direction of the first magnetization.
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公开(公告)号:US20230089204A1
公开(公告)日:2023-03-23
申请号:US17895775
申请日:2022-08-25
Applicant: TDK CORPORATION
Inventor: Keisuke TAKASUGI , Kenzo MAKINO , Hiraku HIRABAYASHI , Masanori SAKAI
Abstract: A magnetic sensor includes a first insulating layer, a second insulating layer, a third insulating layer, a lower coil element located on an opposite side of the first insulating layer from the second insulating layer, and a second MR element. The second MR element includes a magnetization pinned layer and a free layer. The magnetization pinned layer and the free layer are located on an opposite side of the third insulating layer from the second insulating layer. The first and third insulating layers each contain a first insulating material. The second insulating layer contains a second insulating material.
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公开(公告)号:US20200326399A1
公开(公告)日:2020-10-15
申请号:US16912718
申请日:2020-06-26
Applicant: Asahi Kasei Microdevices Corporation , TDK Corporation
Inventor: Masanori YOSHIDA , Yoshitaka OKUTSU , Kazuhiro ISHIDA , Kazuya WATANABE , Hiraku HIRABAYASHI , Masanori SAKAI
Abstract: An object is to provide a magnetic sensor module reducing influence of heat generated from a coil on a magnetic sensor. A conventional method requires, on a magnetic sensor chip, multiple temperature measuring circuits corresponding to multiple magnetic sensors, and many pads for connection to an IC chip. Therefore, the problem is increase in size of the sensor chip mounting the sensors and in manufacturing cost. Provided is a magnetic sensor module comprising an IC chip including a first coil, a first pad connected to one end of the coil, and a second pad to the other end; a magnetic sensor chip disposed on the IC chip's surface, including a first magnetic sensor detecting first axial magnetism; a first external output terminal; a first conductive wire for connecting the first pad and terminal; a second external output terminal; and a second conductive wire for connecting the second pad and terminal.
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公开(公告)号:US20200300602A1
公开(公告)日:2020-09-24
申请号:US16729558
申请日:2019-12-30
Applicant: TDK CORPORATION
Inventor: Shinichirou MOCHIZUKI , Masanori SAKAI
Abstract: An angle sensor includes a first magnetic sensor and a second magnetic sensor. The first magnetic sensor includes first and second detectors, and first and second analog-to-digital converters for converting analog detection signals generated by the first and second detectors into digital detection signals. The second magnetic sensor includes third and fourth detectors, and third and fourth analog-to-digital converters for converting analog detection signals generated by the third and fourth detectors into digital detection signals. The first to fourth analog-to-digital converters perform sampling at the same sampling time.
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公开(公告)号:US20250060428A1
公开(公告)日:2025-02-20
申请号:US18932913
申请日:2024-10-31
Applicant: TDK Corporation
Inventor: Keisuke TAKASUGI , Kenzo MAKINO , Hiraku HIRABAYASHI , Masanori SAKAI
Abstract: A magnetic sensor includes a first insulating layer, a second insulating layer, a third insulating layer, a lower coil element located on an opposite side of the first insulating layer from the second insulating layer, and a second MR element. The second MR element includes a magnetization pinned layer and a free layer. The magnetization pinned layer and the free layer are located on an opposite side of the third insulating layer from the second insulating layer. The first and third insulating layers each contain a first insulating material. The second insulating layer contains a second insulating material.
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公开(公告)号:US20200326390A1
公开(公告)日:2020-10-15
申请号:US16912714
申请日:2020-06-26
Applicant: Asahi Kasei Microdevices Corporation , TDK Corporation
Inventor: Yoshitaka OKUTSU , Masanori YOSHIDA , Kazuhiro ISHIDA , Kazuya WATANABE , Hiraku HIRABAYASHI , Masanori SAKAI
Abstract: An object is to provide a magnetic sensor module that suppresses a size of a magnetic sensor chip while applying a uniform calibration magnetic field to a magneto-resistive element. Provided is a magnetic sensor module comprising an IC chip having a first coil; and a magnetic sensor chip that is disposed on a surface of the IC chip and includes a first magnetic sensor that detects magnetism in a direction of first axis, wherein a planar shape of the IC chip encompasses a planar shape of the magnetic sensor chip, and the first coil has a planar shape including three or more sides, and is, when seen in a cross section along at least one side of the planar shape, is formed so as to cover a region, in a direction of the one side, of the first magnetic sensor.
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