公开(公告)号：US20250141420A1

公开(公告)日：2025-05-01

申请号：US18721502

申请日：2023-05-18

Applicant: TDK Corporation

Inventor： Michiyuki NAKAZAWA ,  Takeshi OOHASHI ,  Daiki KUSUNOKI ,  Yukio MITAKE

IPC: H03H7/01 ,  H03H7/09

Abstract: An electronic component includes a first resonance circuit configured to include a first inductor and a first capacitor; and a second resonance circuit configured to include a second inductor and a second capacitor that are magnetically coupled to the first inductor, in which the first resonance circuit includes a third inductor electrically connected in series with the first inductor, and the third inductor is disposed to be magnetically coupled to the second inductor.

公开(公告)号：US20230309229A1

公开(公告)日：2023-09-28

申请号：US18073670

申请日：2022-12-02

Applicant: TDK CORPORATION

Inventor： Takeshi OOHASHI ,  Yukio MITAKE ,  Daiki KUSUNOKI

IPC: H05K1/16 ,  H05K1/11

CPC classification number: H05K1/165 ,  H05K1/162 ,  H05K1/111 ,  H05K2201/09545 ,  H05K2201/10522 ,  H05K2201/10931 ,  H05K2201/10818

Abstract: An electronic component includes an insulator and an inductor pattern and a capacitor pattern which are arranged in the insulator. The inductor pattern and the capacitor pattern are electrically connected between one end and the other end of the first inductor pattern.

公开(公告)号：US20210204406A1

公开(公告)日：2021-07-01

申请号：US17132626

申请日：2020-12-23

Applicant: TDK Corporation

Inventor： Takeshi OOHASHI ,  Shinichiro TODA ,  Daiki KUSUNOKI ,  Takashi OHTSUKA ,  Kazuhiro YOSHIKAWA ,  Kenichi YOSHIDA

IPC: H05K1/16 ,  H01G4/228 ,  H01G4/33 ,  H01G4/40 ,  H01L49/02

Abstract: Disclosed herein is an electronic component that includes a first conductive layer including a lower electrode and a first inductor pattern, a dielectric film that covers the lower electrode, an upper electrode laminated on the lower electrode through the dielectric film, an insulating layer that covers the first conductive layer, dielectric film, and upper electrode, and a second conductive layer formed on the insulating layer and including a second inductor pattern. The first and second inductor patterns are connected in parallel through via conductors penetrating the insulating layer.