公开(公告)号：US20230345622A1

公开(公告)日：2023-10-26

申请号：US17728758

申请日：2022-04-25

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： CHUN-WEI CHANG ,  JIAN-HONG LIN ,  SHU-YUAN KU ,  WEI-CHENG LIU ,  YINLUNG LU ,  JUN HE

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/42

CPC classification number: H05K1/0242 ,  H05K1/0251 ,  H05K1/116 ,  H05K3/427 ,  H05K3/429 ,  H05K2201/0776

Abstract: A package component and forming method thereof are provided. The package component includes a substrate and a conductive layer. The substrate includes a first surface. The conductive layer is disposed over the first surface. The conductive layer includes a first conductive feature and a second conductive feature. The second conductive feature covers a portion of the first conductive feature. A resistance of the second conductive feature is lower than a resistance of the first conductive feature.

公开(公告)号：US20240215150A1

公开(公告)日：2024-06-27

申请号：US18423227

申请日：2024-01-25

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： CHUN-WEI CHANG ,  JIAN-HONG LIN ,  SHU-YUAN KU ,  WEI-CHENG LIU ,  YINLUNG LU ,  JUN HE

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/42

CPC classification number: H05K1/0242 ,  H05K1/0251 ,  H05K1/116 ,  H05K3/427 ,  H05K3/429 ,  H05K2201/0776

Abstract: A package component includes a first substrate and a first conductive layer. The first substrate has a first surface and a second surface opposite to the first surface. The first conductive layer is disposed over the first surface of the first substrate. The first conductive layer includes a first conductive feature and a second conductive feature over the first conductive feature. The second conductive features covers a portion of the first conductive feature. A resistance of the second conductive feature is lower than a resistance of the second conductive feature. The first substrate includes a single-sided or a double-sided copper-clad laminate.