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公开(公告)号：US20230387651A1
公开(公告)日：2023-11-30
申请号：US18321818
申请日：2023-05-23
发明人： Naoki ITABASHI , Kosuke SEKIGUCHI , Michio SUZUKI , Tomoya SAEKI
IPC分类号： H01S5/02315 , H01S5/0231
CPC分类号： H01S5/02315 , H01S5/0231
摘要： An optical module includes an optical semiconductor element a stem including a signal pin and a ground pin; and a circuit board, the circuit board including a signal through-hole, a ground through-hole, a ground layer, and a junction part, the signal through-hole being configured to be pierced by the signal pin, the ground through-hole being configured to be pierced by the ground pin, the signal line being configured to be electrically connected with the signal pin, the ground layer being configured to be electrically connected with the ground pin, the junction part being configured to connect the assistance through-hole and the ground layer around the assistance through-hole with the stem. The circuit board has a first distance between the assistance through-hole and the signal through-hole, the first distance being smaller than a second distance between the ground through-hole and the signal through-hole.
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公开(公告)号：US20240302707A1
公开(公告)日：2024-09-12
申请号：US18597561
申请日：2024-03-06
发明人： Kosuke SEKIGUCHI , Keiji TANAKA
摘要： An optical semiconductor device includes: an element portion provided on a principal surface of a substrate; first protruding portions provided on the principal surface; a resin body including a top surface and embedding the element portion and the first protruding portions; a wiring provided on the top surface; and a protective film covering the top surface and the wiring. The element portion includes a mesa protruding portion including a first semiconductor layer, and a mesa waveguide. The first protruding portions are separated from each other and each includes the first semiconductor layer. The wiring is provided between the first protruding portions and the element portion and includes a side surface adjacent to the first protruding portions. An angle formed by a first portion covering the side surface of the wiring and a second portion covering the top surface and connected to the first portion is acute.
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