公开(公告)号：US20230163000A1

公开(公告)日：2023-05-25

申请号：US17916894

申请日：2021-04-15

Applicant: Sony Semiconductor Solutions Corporation

Inventor： Kaihei Hotta ,  Kyoichi Takenaka ,  Naoki Kawazu

IPC: H01L21/67 ,  G01K7/01 ,  G01K7/16

CPC classification number: H01L21/67248 ,  G01K7/015 ,  G01K7/16

Abstract: An object of the present invention is to provide a semiconductor apparatus capable of recognizing the actual temperature for each semiconductor chip even while driving the device.
A semiconductor apparatus of the present disclosure includes a semiconductor chip, a plurality of pad electrodes formed in the semiconductor chip, and an impedance element electrically connected between at least two pad electrodes of the plurality of pad electrodes. Then, the semiconductor apparatus is configured to be capable of measuring a temperature of the semiconductor chip by applying a certain electrical signal between the at least two pad electrodes connected with the impedance element from outside of the semiconductor chip.