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    Electronic apparatus and fabrication method therefor
    3.
    发明授权
    Electronic apparatus and fabrication method therefor 有权

    公开(公告)号：US11013129B2

    公开(公告)日：2021-05-18

    申请号：US17004859

    申请日：2020-08-27

    Applicant: Sony Interactive Entertainment Inc.

    Inventor： Yukito Inoue ,  Yasuhiro Ootori ,  Tetsu Sumii

    IPC: H05K5/00 ,  G06F1/18 ,  H05K7/20 ,  G06F1/20 ,  A63F13/90 ,  H05K5/02 ,  H05K5/03 ,  H05K7/14

    Abstract: An electronic apparatus includes: a first cover having a first face portion that covers a plurality of parts built in the electronic apparatus, and a first peripheral face portion which provides a first portion of an outer peripheral face of the electronic apparatus; a second cover having a second face portion that covers the plurality of parts, and a second peripheral face portion which provides a second portion of the outer peripheral face of the electronic apparatus; a channel defined by a separation between the first cover and the second cover, where the first and second face portions are opposite to one another, a first peripheral edge of the first cover and a second peripheral edge of the second cover oppose one another and do not meet, thereby defining the separation between the first cover and the second cover; and a plurality of air vent holes located through at least one wall surface within the channel.

    Headphone
    7.
    外观设计
    Headphone 有权

    公开(公告)号：USD808361S1

    公开(公告)日：2018-01-23

    申请号：US29586972

    申请日：2016-12-08

    Applicant: SONY INTERACTIVE ENTERTAINMENT INC.

    Designer： Tetsu Sumii

    Abstract: The design consists of the features of the shape, ornament, pattern and configuration of the portion of the HEADPHONE as shown in solid lines in the drawings. The stippled line portions do not form part of the design.Drawings of the design are enclosed, in which:Figure 1 is a front, top and right side perspective view of the Headphone showing the new design;Figure 2 is a view of rear, bottom and left side perspective view of the Headphone showing the new design;Figure 3 is a front view of the Headphone showing the new design;Figure 4 is a rear view of the Headphone showing the new design;Figure 5 is a left side view of the Headphone showing the new design;Figure 6 is a right side view of the Headphone showing the new design;Figure 7 is a top view of the Headphone showing the new design;Figure 8 is a bottom view of the Headphone showing the new design;Figure 9 is a front view in an alternate state of the Headphone showing the new design;Figure 10 is another view in an alternate state of die Headphone showing the new design; andFigure 11 is another view in an alternate state of the Headphone showing the new design.

    Directional Interface Object
    8.
    发明申请
    Directional Interface Object 审中-公开

    公开(公告)号：US20170354864A1

    公开(公告)日：2017-12-14

    申请号：US15283110

    申请日：2016-09-30

    Applicant: Sony Interactive Entertainment Inc.

    Inventor： Mark Rogers ,  Dana Chung ,  Thomas Bruckbock ,  Tetsu Sumii ,  Taichi Nokuo ,  Seth Luisi

    IPC: A63F13/213 ,  A63F13/837 ,  A63F13/24

    Abstract: A directional interface object, including: a top tubular portion; a front tubular portion, a top end of the front tubular portion being joined to a first end of the top tubular portion; a bottom tubular portion, a first end of the bottom tubular portion being joined to a bottom end of the front tubular portion; a rear tubular portion, a top end of the rear tubular portion being joined to a second end of the front tubular portion opposite the first end of the front tubular portion, a bottom end of the rear tubular portion being joined to a second end of the bottom tubular portion opposite the first end of the bottom tubular portion; a trackable object disposed at the first end of the top tubular portion.

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