公开(公告)号：US11598914B2

公开(公告)日：2023-03-07

申请号：US17411269

申请日：2021-08-25

Applicant: Snap Inc.

Inventor： David Fliszar ,  Amit Singh

IPC: F21V8/00 ,  G02B6/02

Abstract: A lightweight stacked optical waveguide using two plastic substrates having nano-structure gratings and a single glass substrate sandwiched between them. The nano-structure gratings face each other, and are each encapsulated within the optical waveguide. The two plastic substrates are each adhesively secured to the central glass substrate rather than to each other to provide sufficient securing strength and precisely establish and maintain an air gap between the substrates. The thickness of the plastic substrates and the glass substrate are selected such that the stacked optical waveguide is lightweight, but also has sufficient drop performance. The stacked optical waveguide can be efficiently manufactured as the adhesive bonds a plastic substrate to a glass substrate.

公开(公告)号：US20230185016A1

公开(公告)日：2023-06-15

申请号：US18107584

申请日：2023-02-09

Applicant: Snap Inc.

Inventor： David Fliszar ,  Amit Singh

IPC: F21V8/00 ,  G02B6/02

CPC classification number: G02B6/0076 ,  G02B6/02395 ,  G02B6/02209

Abstract: A lightweight stacked optical waveguide using two plastic substrates having nano-structure gratings and a single glass substrate sandwiched between them. The nano-structure gratings face each other, and are each encapsulated within the optical waveguide. The two plastic substrates are each adhesively secured to the central glass substrate rather than to each other to provide sufficient securing strength and precisely establish and maintain an air gap between the substrates. The thickness of the plastic substrates and the glass substrate are selected such that the stacked optical waveguide is lightweight, but also has sufficient drop performance. The stacked optical waveguide can be efficiently manufactured as the adhesive bonds a plastic substrate to a glass substrate.

公开(公告)号：US20220075110A1

公开(公告)日：2022-03-10

申请号：US17411269

申请日：2021-08-25

Applicant: Snap Inc.

Inventor： David Fliszar ,  Amit Singh

IPC: F21V8/00 ,  G02B6/02

Abstract: A lightweight stacked optical waveguide using two plastic substrates having nano-structure gratings and a single glass substrate sandwiched between them. The nano-structure gratings face each other, and are each encapsulated within the optical waveguide. The two plastic substrates are each adhesively secured to the central glass substrate rather than to each other to provide sufficient securing strength and precisely establish and maintain an air gap between the substrates. The thickness of the plastic substrates and the glass substrate are selected such that the stacked optical waveguide is lightweight, but also has sufficient drop performance. The stacked optical waveguide can be efficiently manufactured as the adhesive bonds a plastic substrate to a glass substrate.

公开(公告)号：US11927794B2

公开(公告)日：2024-03-12

申请号：US18107584

申请日：2023-02-09

Applicant: Snap Inc.

Inventor： David Fliszar ,  Amit Singh

IPC: F21V8/00 ,  G02B6/02

CPC classification number: G02B6/0076 ,  G02B6/02395 ,  G02B6/02209

Abstract: A lightweight stacked optical waveguide using two plastic substrates having nano-structure gratings and a single glass substrate sandwiched between them. The nano-structure gratings face each other, and are each encapsulated within the optical waveguide. The two plastic substrates are each adhesively secured to the central glass substrate rather than to each other to provide sufficient securing strength and precisely establish and maintain an air gap between the substrates. The thickness of the plastic substrates and the glass substrate are selected such that the stacked optical waveguide is lightweight, but also has sufficient drop performance. The stacked optical waveguide can be efficiently manufactured as the adhesive bonds a plastic substrate to a glass substrate.

公开(公告)号：US20220080529A1

公开(公告)日：2022-03-17

申请号：US17459112

申请日：2021-08-27

Applicant: Snap Inc.

Inventor： Benamanahalli K. Nagaraj ,  Amit Singh ,  David Fliszar

IPC: B23K26/38 ,  G02B6/10 ,  B23K26/402

Abstract: Cutting a wafer having devices, such as glass optical waveguides, into die by cutting into both sides of the wafer to reduce or eliminate micro-cracks and defects in the die. The wafer can be cut by simultaneously cutting the wafer from both sides using separate lasers at a controlled depth. The wafer can also be sequentially cut by cutting into one side of the wafer, flipping the wafer, and then cutting into the other side of the wafer. A processor controls the power of each laser to select the depth of each cut, such that each cut may be 50% into the wafer, or other depths such as 30% for one cut and 70% for the other cut. The wafer may be cut into the bottom surface of the wafer first, and then cut into the top surface of the wafer having the optical waveguides.